
ABL HEATSINKS BGA-FC-010 Heat Sink, For Ball Grid Array, Flip-Chip, BGA, 13.5 C/W, 10 mm, 40 mm, 40 mm

Thermal Transfer 242mm 446mm 274mm RS-232C/USB 2.0/10/100 Base-TX

ABL HEATSINKS BGA-PP-040 Heat Sink, For Ball Grid Array, Push-Pin, BGA, 6.5 C/W, 35 mm, 49 mm, 49 mm