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Product Change NoticeMicrochip

Microchip Qualification Plan for QMI519 Die Attach and CuPdAu Bond Wire in 8L SOIC Packages

Qualification plan for QMI519 die attach and CuPdAu bond wire materials for Microchip SST25WF series Serial Flash memory in 8L SOIC packages at the MTAI assembly site.

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Overview

This document (PCN BLAS-06KHYB542) details the qualification plan for utilizing QMI519 as an additional die attach material and palladium coated copper with gold flash (CuPdAu) as an additional bond wire material. The qualification applies to specific SST25WF040B and SST25WF080B Serial Flash memory catalog part numbers in 8-lead SOIC (.150in) packages assembled at Microchip's MTAI site. The plan includes reliability testing such as High Temperature Storage Life (HTSL), MSL 1 preconditioning, HAST, Unbiased HAST, and Temperature Cycling (-65°C to +150°C) per JEDEC and Mil. Std. 883 requirements.

Use Cases

  • Verification of material changes for SST25WF040B and SST25WF080B flash memory
  • Review of reliability testing protocols for Microchip components
  • Assessing impact of assembly material updates on 8L SOIC packages

Topics

Microchip
SST25WF080B
SST25WF040B
QMI519
CuPdAu
bond wire
die attach
8L SOIC
PCN
reliability qualification
serial flash

Referenced Parts

SST25WF040B-40E/SN

Microchip

SST25WF040B-40E/SN, SST25WF040B-40I/SN, SST25WF040BT- 40E/SN, SST25WF040BT-40I/SN, SST25WF080B-40E/SN, SST25WF080BT-40E/SN and SST25WF080BT-40I/SN catalog part numbers (CPN)

SST25WF040B-40I/SN

Microchip

SST25WF040B-40I/SN, SST25WF040BT- 40E/SN, SST25WF040BT-40I/SN, SST25WF080B-40E/SN, SST25WF080BT-40E/SN and SST25WF080BT-40I/SN catalog part numbers (CPN)

SST25WF040BT-40E/SN

Microchip

SST25WF040BT- 40E/SN, SST25WF040BT-40I/SN, SST25WF080B-40E/SN, SST25WF080BT-40E/SN and SST25WF080BT-40I/SN catalog part numbers (CPN)

SST25WF040BT-40I/SN

Microchip

SST25WF040BT-40I/SN, SST25WF080B-40E/SN, SST25WF080BT-40E/SN and SST25WF080BT-40I/SN catalog part numbers (CPN)

SST25WF080B-40E/SN

Microchip

SST25WF080B-40E/SN, SST25WF080BT-40E/SN and SST25WF080BT-40I/SN catalog part numbers (CPN)

SST25WF080B-40I/SN

Microchip

additional bond wire material for SST25WF080B-40I/SN, SST25WF040B-40E/SN, SST25WF040B-40I/SN, SST25WF040BT- 40E/SN, SST25WF040BT-40I/SN, SST25WF080B-40E/SN, SST25WF080BT-40E/SN and SST25WF080BT-40I/SN catalog part numbers (CPN)

SST25WF080BT-40E/SN

Microchip

SST25WF080BT-40E/SN and SST25WF080BT-40I/SN catalog part numbers (CPN)

SST25WF080BT-40I/SN

Microchip

SST25WF080BT-40I/SN catalog part numbers (CPN) available in 8L SOIC (.150in) package

125C

Microchip

125C temp.

125C

Microchip

Electrical test pre and post stress at 85C and 125C

260C

Microchip

MSL 1 @ 260C

40E/SN

Microchip

40E/SN, SST25WF040BT-40I/SN, SST25WF080B-40E/SN,

40I/SN

Microchip

40I/SN, SST25WF080B-40E/SN, SST25WF080BT-40E/SN and

85C

Microchip

Electrical test pre and post stress at 85C and 125C

85C

Microchip

Electrical test pre and post stress at +25C, 85C and

B100

Microchip

Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 5

B108

Microchip

Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 5

BLAS-06KHYB542

Microchip

PCN #: BLAS-06KHYB542

CDF-AEC-Q100-001

Microchip

Wire Bond Shear - WBS CDF-AEC-Q100-001 5 0 1 5 5 30 bonds from a min. 5 devices.

JESD22

Microchip

Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 5

JESD22-A103.

Microchip

HTSL (High Temp Storage Life) JESD22-A103. +175 C for 504 hours

JESD22-A104.

Microchip

Temp Cycle JESD22-A104. -65°C to +150°C for 500 cycles.

JESD22-A110.

Microchip

HAST JESD22-A110. +130°C/85% RH for 96 hours or

JESD22-A113.

Microchip

JESD22-A113. +150°C Bake for 24 hours, moisture

JESD22-A118.

Microchip

UHAST JESD22-A118. +130°C/85% RH for 96 hrs or

Jedec-STD-020E

Microchip

peak reflow temperature per Jedec-STD-020E for

QMI519

Microchip

Qualification of QMI519 as an additional die attach material and

SST25WF040BT-

Microchip

SST25WF040B-40I/SN, SST25WF040BT-40E/SN, SST25WF040BT-

SST25WF040BT-

Microchip

SST25WF040B-40E/SN, SST25WF040B-40I/SN, SST25WF040BT-

Microchip Qualification Plan for QMI519 Die Attach and CuPdAu Bond Wire in 8L SOIC Packages | Design Resources