WELLER NTD. Soldering Iron Tip, Chisel, 4 mm
HYNIX SEMICONDUCTOR H5TQ4G63MFR-H9C SDRAM, DDR3, 4GB (X16), 96FBGA
DDR3 SDRAM 2Gbit 128Mx16 1.5V 96-Pin FBGA
DDR3 SDRAM 2Gbit 512Mx4 1.5V 82-Pin FBGA
HYNIX SEMICONDUCTOR H5TQ2G63BFR-H9C SDRAM, DDR3, 2GB (X16), 96FBGA
DRAM Chip DDR3 SDRAM 4G-Bit 512Mx8 1.5V 78-Pin FBGA
DDR3 SDRAM 2Gbit 256Mx8 1.5V 82-Pin FBGA
HYNIX SEMICONDUCTOR H5TQ1G63BFR-H9C SDRAM, DDR3, 1GB (X16), 96FBGA
DRAM Chip DDR3 SDRAM 2G-Bit 128Mx16 1.5V 96-Pin FBGA
DRAM Chip DDR3 SDRAM 1G-Bit 128Mx8 1.5V 78-Pin F-BGA
Solid State Relay 10mA 32V DC-IN 10A 280V AC-OUT 4-Pin
Solid State Relay 10mA 32V DC-IN 25A 280V AC-OUT 4-Pin
Solid State Relay 13mA 15V DC-IN 5A 280V AC-OUT 4-Pin
4A, 600V, 2.4ohm, N-CHANNEL, Si, POWER, MOSFET, DPAK-3
5A, 500V, 1.7ohm, N-CHANNEL, Si, POWER, MOSFET, DPAK-3
GLOVE, POLYAMIDE, L/FREE, PU, SIZE 6 - More Details
12A, 60V, 0.18ohm, P-CHANNEL, Si, POWER, MOSFET, CASE 369C-01, DPAK-3
MOSFET, N CH, 30V, 14.5A, IPAKTR
12A, 60V, 0.18ohm, P-CHANNEL, Si, POWER, MOSFET, CASE 369A-13, DPAK-3
11.4A, 25V, 0.006ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 369AA-01, DPAK-3
