Search Results for &quot; AT-109 &quot;

32-bit 512KB FLASH MCU, AVR, 66MHz, LQFP

MS-026, LQFP-144

Active

Package/Case: LQFP

Core Architecture: AVR

Data Bus Width: 32b

Density: 512KB

STM32F407VGT7TR

32-bit MCU, 1MB Flash, 168MHz, Cortex-M4, 100-Pin PQFP

LFQFP, QFP100,.63SQ,20

Active

Max Operating Temperature: 105

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: QUAD

RP12-4805SAW/SMD

Recom

DC-DC Converter 48VIN 5.1V 2.4A 12W Isolated 18-Pin SMD

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: DIP

Package/Case: DIP SMD

Package Description: Surface Mount Dual In Line Package

STM32F103VEH6TR

32-bit ARM Cortex M3 MCU, 72MHz, 512KB Flash, 100-Pin LFBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

STM32F405RGT7TR

32-bit MCU, Cortex-M4, 1MB Flash, 168MHz, 64-pin PQFP

LFQFP, QFP64,.47SQ,20

Active

Max Operating Temperature: 105

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: QUAD

A6KV-162RS

Omron

SP16T Rotary DIP Switch, 0.025A 24VDC, 16 Pos, Extended Shaft, PC Pins, Thru-Hole

Through Hole

Active

Actuator Style: Extended Shaft

Termination Style: PC Pins

Mounting: Through Hole

Body Orientation: Right Angle

M705-GRN360-KV

Senju Metal Industry

Lead Free - Solder Paste

Active

Alloy Composition: Sn 96.5: Ag3.0:Cu 0.5

Melting Temperature: 217-219°C

Powder Size: 25-36um

Flux Type: ROLO

AT32UC3A0256-ALUT

32-bit AVR MCU, 66MHz, 256KB Flash, 144LQFP

MS-026, LQFP-144

Active

Package/Case: LQFP

Core Architecture: AVR

Data Bus Width: 32b

Frequency: 66MHz

STM32F415RGT6TR

32-Bit ARM Cortex-M4 MCU, 1MB Flash, 168MHz, 64-Pin PQFP

LQFP-64

Active

Max Operating Temperature: 85

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: QUAD

STM32L476QEI6TR

32-bit ARM Cortex-M4 MCU, 80MHz, 512KB Flash, 132-pin BGA

UFBGA-132

Active

Max Operating Temperature: 85

Number of Terminals: 132

Min Operating Temperature: -40

Terminal Position: BOTTOM

STM32F417IGH6TR

32-bit MCU, Cortex-M4, 1MB Flash, 168MHz, 176-pin BGA

VFBGA, BGA176,15X15,25

Active

Max Operating Temperature: 85

Number of Terminals: 176

Min Operating Temperature: -40

Terminal Position: BOTTOM

STM32F407IEH7

32-bit MCU, Cortex-M4, 168MHz, 512KB Flash, 140 I/O, BGA-201

VFBGA, BGA201,15X15,25

Active

Max Operating Temperature: 105

Number of Terminals: 201

Min Operating Temperature: -40

Terminal Position: BOTTOM

APM7314KC-TRL

N-CH MOSFET 30V 8A Dual Dual Drain 8-Pin SOP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SOP

Package Description: Plastic Small Outline Package

APM7314KC-TRG

30V 8A N-CH Power MOSFET, Dual Drain, 8-Pin SOP

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SOP

Package Description: Plastic Small Outline Package

AT32UC3A0256-CTUR

32-bit MCU 256KB FLASH 66MHz AVR TFBGA

MS-026, FFBGA-144

Active

Package/Case: TFBGA

Contact Plating: Copper, Tin, Silver

Core Architecture: AVR

Data Bus Width: 32b

STM32F103VCH6TR

32-bit ARM Cortex M3 MCU, 72MHz, 256KB Flash, 100-Pin LFBGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

STM32F103VEH7TR

32-bit ARM Cortex M3 MCU, 72MHz, 512KB Flash, 100-Pin LFBGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

CMAX-DM60-CPUSEICell-Max™

Commscope

Cell Max Directional High Capacity Venue MIMO Antenna

Bracket

Obsolete

Package Length (mm): 299.7

Package Width (mm): 299.7

Package Height (mm): 124.5

Mounting: Bracket

STM32F103VCH7

32-bit ARM Cortex M3 MCU, 72MHz, 256KB Flash, 100-Pin LFBGA

Ball Grid Array

Preliminary

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

STM32F103VDH7TR

32-bit ARM Cortex M3 MCU, 72MHz, 384KB Flash, 100-Pin LFBGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

Search Results for "AT-109"

Filters

AT32UC3A0512-ALUT

32-bit 512KB FLASH MCU, AVR, 66MHz, LQFP

MS-026, LQFP-144

Active

Package/Case: LQFP

Core Architecture: AVR

Data Bus Width: 32b

Density: 512KB

STM32F407VGT7TR

32-bit MCU, 1MB Flash, 168MHz, Cortex-M4, 100-Pin PQFP

LFQFP, QFP100,.63SQ,20

Active

Max Operating Temperature: 105

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: QUAD

RP12-4805SAW/SMD

Recom

DC-DC Converter 48VIN 5.1V 2.4A 12W Isolated 18-Pin SMD

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: DIP

Package/Case: DIP SMD

Package Description: Surface Mount Dual In Line Package

STM32F103VEH6TR

32-bit ARM Cortex M3 MCU, 72MHz, 512KB Flash, 100-Pin LFBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

STM32F405RGT7TR

32-bit MCU, Cortex-M4, 1MB Flash, 168MHz, 64-pin PQFP

LFQFP, QFP64,.47SQ,20

Active

Max Operating Temperature: 105

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: QUAD

A6KV-162RS

Omron

SP16T Rotary DIP Switch, 0.025A 24VDC, 16 Pos, Extended Shaft, PC Pins, Thru-Hole

Through Hole

Active

Actuator Style: Extended Shaft

Termination Style: PC Pins

Mounting: Through Hole

Body Orientation: Right Angle

M705-GRN360-KV

Senju Metal Industry

Lead Free - Solder Paste

Active

Alloy Composition: Sn 96.5: Ag3.0:Cu 0.5

Melting Temperature: 217-219°C

Powder Size: 25-36um

Flux Type: ROLO

AT32UC3A0256-ALUT

32-bit AVR MCU, 66MHz, 256KB Flash, 144LQFP

MS-026, LQFP-144

Active

Package/Case: LQFP

Core Architecture: AVR

Data Bus Width: 32b

Frequency: 66MHz

STM32F415RGT6TR

32-Bit ARM Cortex-M4 MCU, 1MB Flash, 168MHz, 64-Pin PQFP

LQFP-64

Active

Max Operating Temperature: 85

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: QUAD

STM32L476QEI6TR

32-bit ARM Cortex-M4 MCU, 80MHz, 512KB Flash, 132-pin BGA

UFBGA-132

Active

Max Operating Temperature: 85

Number of Terminals: 132

Min Operating Temperature: -40

Terminal Position: BOTTOM

STM32F417IGH6TR

32-bit MCU, Cortex-M4, 1MB Flash, 168MHz, 176-pin BGA

VFBGA, BGA176,15X15,25

Active

Max Operating Temperature: 85

Number of Terminals: 176

Min Operating Temperature: -40

Terminal Position: BOTTOM

STM32F407IEH7

32-bit MCU, Cortex-M4, 168MHz, 512KB Flash, 140 I/O, BGA-201

VFBGA, BGA201,15X15,25

Active

Max Operating Temperature: 105

Number of Terminals: 201

Min Operating Temperature: -40

Terminal Position: BOTTOM

APM7314KC-TRL

N-CH MOSFET 30V 8A Dual Dual Drain 8-Pin SOP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SOP

Package Description: Plastic Small Outline Package

APM7314KC-TRG

30V 8A N-CH Power MOSFET, Dual Drain, 8-Pin SOP

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SOP

Package Description: Plastic Small Outline Package

AT32UC3A0256-CTUR

32-bit MCU 256KB FLASH 66MHz AVR TFBGA

MS-026, FFBGA-144

Active

Package/Case: TFBGA

Contact Plating: Copper, Tin, Silver

Core Architecture: AVR

Data Bus Width: 32b

STM32F103VCH6TR

32-bit ARM Cortex M3 MCU, 72MHz, 256KB Flash, 100-Pin LFBGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

STM32F103VEH7TR

32-bit ARM Cortex M3 MCU, 72MHz, 512KB Flash, 100-Pin LFBGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

CMAX-DM60-CPUSEICell-Max™

Commscope

Cell Max Directional High Capacity Venue MIMO Antenna

Bracket

Obsolete

Package Length (mm): 299.7

Package Width (mm): 299.7

Package Height (mm): 124.5

Mounting: Bracket

STM32F103VCH7

32-bit ARM Cortex M3 MCU, 72MHz, 256KB Flash, 100-Pin LFBGA

Ball Grid Array

Preliminary

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

STM32F103VDH7TR

32-bit ARM Cortex M3 MCU, 72MHz, 384KB Flash, 100-Pin LFBGA