Search Results for &quot; CY96F348ASBPMC-GS-UJE2 &quot;

UJA1169L - Mini high-speed CAN companion system basis chip

Obsolete

Interface IC Type: INTERFACE CIRCUIT

GSS-8-3.8-G

Interconnect Devices

INTERCONNECT DEVICES GSS-8-3.8-G TEST CONNECTOR

Volume Production

Package/Case: 100

Current Rating: 3A

Length: 10.79mm

Reach SVHC Compliant: Unknown

GS4EH

Panduit

PANDUIT GS4EH Cable Management Tool, Cable Tie Tool, Installation Tool GS Series

Not Recommended for New Design

Package/Case: Metal

Color: Blue, Grey

Height: 174mm

Length: 139mm

U1GC44(TE12R,UJ,Q)

Rectifier Diode 400V 0.9A 2-Pin I-FLAT T/R

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: I-FLAT

Package/Case: I-FLAT

Lead Shape: J-Lead

+17

U1ZB15(TE12R,UJ,Q)

Zener Diode Single 15V 10% 30Ohm 1000mW 2-Pin I-FLAT T/R

I-FLAT

Obsolete

Package Family Name: I-FLAT

Package/Case: I-FLAT

Pin Count: 2

PCB: 2

+14

UJB0L273THD

Cap Aluminum Lytic 27000uF 5.5V -10% to 50% (16 X 35.5mm) Radial 7.5mm 1000h 85°C Bulk

Through Hole

Obsolete

Capacitance: 27mF

Package/Case: Radial

Impedance: 200mR

Leakage Current: 27uA

+12

UJB0L393THD

Cap Aluminum Lytic 39000uF 5.5V -10% to 50% (18 X 35.5mm) Radial 7.5mm 1000h 85°C Bulk

Through Hole

Obsolete

Capacitance: 39mF

Package/Case: Radial

Impedance: 100mR

Leakage Current: 39uA

+12

UJ2-MIBH-3-MSMT-TR-67

CUI Devices

USB 2.0 Receptacle, 1.8A, 5 Pos, Right Angle SMT, Waterproof

Active

Max Operating Temperature: 85

Min Operating Temperature: -30

Number of Ports: 1

Termination Type: SURFACE MOUNT

UJA1065TW/3V3/C

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1075TW/3V3

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1075TW/5V0

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1061TW/3V3/C/T,

HIGH PERFORMANCE SYSTEM BASIS CHIP

Surface Mount

LTB

Package/Case: HTSSOP EP

Pin Count: 32

PCB: 32

Package Length (mm): 11.1(Max)

U1ZB51(TE12R,UJ,Q)

Zener Diode Single 51V 10% 65Ohm 1000mW 2-Pin I-FLAT T/R

I-FLAT

Obsolete

Package Family Name: I-FLAT

Package/Case: I-FLAT

Pin Count: 2

PCB: 2

+14

U1ZB27(TE12R,UJ,Q)

Zener Diode Single 27V 10% 30Ohm 1000mW 2-Pin I-FLAT T/R

I-FLAT

Obsolete

Package Family Name: I-FLAT

Package/Case: I-FLAT

Pin Count: 2

PCB: 2

+14

UJB0L183THD

Cap Aluminum Lytic 18000uF 5.5V -10% to 50% (16 X 25mm) Radial 7.5mm 1000h 85°C Bulk

Through Hole

Obsolete

Capacitance: 18mF

Package/Case: Radial

Impedance: 200mR

Lead Pitch: 7.5mm

+13

UJB0L333THD

Cap Aluminum Lytic 33000uF 5.5V -10% to 50% (18 X 31.5mm) Radial 7.5mm 1000h 85°C Bulk

Through Hole

Obsolete

Capacitance: 33mF

Package/Case: Radial

Impedance: 200mR

Leakage Current: 33uA

+12

UJA1076TW/5V0

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1018TK,118

HIGH PERFORMANCE SYSTEM BASIS CHIP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: SON

Package/Case: HVSON EP

Package Description: Heat Sinked Very Thin Small Outline No Lead, Exposed Pad

UJA1061TW/3V3/C/T

Fault-tolerant CAN/LIN fail-safe system basis chip; Package: SOT549-1 (HTSSOP32); Container: Tube Dry Pack

HTSSOP,

End Of Life

Package/Case: HTSSOP EP

Interface: CAN, LIN

Max Operating Temperature: 125°C

Min Operating Temperature: -40°C

UJA1164TK,118

UJA1164 - Mini high-speed CAN system basis chip with Standby mode & watchdog SON 14-Pin