Search Results for &quot; P2012BPC &quot;

Res Thin Film 2010 75K Ohm 0.1% 1W 10ppm/C Molded SMD SMD Waffle Pack

Not Recommended for New Design

Package/Case: 2010

Contact Plating: Tin, Lead

Max Operating Temperature: 155°C

Min Operating Temperature: -55°C

P2010E2004BB

Res Thin Film 2010 2M Ohm 0.1% 1/2W 25ppm/C Molded SMD SMD Waffle Pack

Unknown

Package/Case: 2010

Contact Plating: Tin, Lead

Max Operating Temperature: 155°C

Min Operating Temperature: -55°C

P2010E30R0BB

Res Thin Film 2010 30 Ohm 0.1% 1W 25ppm/C Molded SMD SMD Waffle Pack

Not Recommended for New Design

Package/Case: 2010

Contact Plating: Tin, Lead

Max Operating Temperature: 155°C

Min Operating Temperature: -55°C

P2010NXN2HFC

MPU QorIQ P2010 32bit 45nm 800MHz 689-Pin TEBGA II Tray

BGA

Active

Package/Case: BGA

Data Bus Width: 32b

Frequency: 800MHz

Halogen Free: Halogen Free

+15

P2010NSN2MFC

1200MHz, RISC PROCESSOR, PBGA689

BGA,

Active

Data Bus Width: 32b

Frequency: 1.2GHz

Interface: I2C, Ethernet, SPI, USB, UART, PCI

Max Frequency: 1.2GHz

+12

P2010NSE2MHC

1200MHz, RISC PROCESSOR, PBGA689

BGA,

Active

Data Bus Width: 32b

Frequency: 1.2GHz

Halogen Free: Halogen Free

Lead Free: Lead Free

+10

P2010NXE2KHC

1000MHz, RISC PROCESSOR, PBGA689

BGA,

Active

Data Bus Width: 32b

Frequency: 1GHz

Halogen Free: Halogen Free

Max Operating Temperature: 125°C

P2010NXE2HHC

PowerPC e500v2 Microprocessor IC QorIQ P2 1 Core, 32-Bit 1.2GHz 689-TEPBGA II (31x31)

End of Life

Data Bus Width: 32b

Halogen Free: Halogen Free

Max Operating Temperature: 125°C

Memory Type: ROM, L2 Cache

P2010Z1001PB

Res Thin Film 2010 1K Ohm 0.02% 1W 5ppm/C Molded SMD SMD Waffle Pack

Volume Production

Package/Case: 2010

Contact Plating: Tin, Lead

Max Operating Temperature: 155°C

Min Operating Temperature: -55°C

P2010H1001FB

Res Thin Film 2010 1K Ohm 1% 1W 50ppm/C Molded SMD SMD Waffle Pack

Not Recommended for New Design

Package/Case: 2010

Contact Plating: Tin, Lead

Max Operating Temperature: 155°C

Min Operating Temperature: -55°C

P2010H3015CN

Res Thin Film 2010 30.1M Ohm 0.25% 1W 50ppm/C Molded SMD SMD Waffle Pack

Volume Production

Package/Case: 2010

Contact Plating: Tin, Silver

Max Operating Temperature: 155°C

Min Operating Temperature: -55°C

P2010NXN2HHC

PowerPC e500v2 Microprocessor IC QorIQ P2 1 Core, 32-Bit 1.2GHz 689-TEPBGA II (31x31)

End of Life

Package/Case: BGA

Data Bus Width: 32b

Frequency: 800MHz

Halogen Free: Halogen Free

+14

P2010NSE2HFC

800MHz, RISC PROCESSOR, PBGA689

BGA,

Active

Data Bus Width: 32b

Frequency: 800MHz

Halogen Free: Halogen Free

Interface: I2C, Ethernet

+11

P2010NXE2KFC

Freescale Semiconductor

QorIQ, 32-Bit Power Arch SoC, 1GHz, DDR2/3 w/ECC, GbE, PCIe, SRIO, USB, SEC, -40 to 125C, Rev 2.1

31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, WB-TEBGA II-689

Transferred

Number of Terminals: 689

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B689

Width: 31

+10

P2010NSN2MHC

1200MHz, RISC PROCESSOR, PBGA689

BGA,

Active

Number of Terminals: 689

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B689

Width: 31

P2010NXE2MHC

1200MHz, RISC PROCESSOR, PBGA689

BGA,

Active

Data Bus Width: 32b

Halogen Free: Halogen Free

Max Frequency: 1.2GHz

Max Operating Temperature: 125°C

P2010NSE2KHC

1000MHz, RISC PROCESSOR, PBGA689

BGA,

Active

Data Bus Width: 32b

Halogen Free: Halogen Free

Max Operating Temperature: 125°C

Memory Type: ROM, L2 Cache

P2010H8060FN

Res Thin Film 2010 806 Ohm 1% 1W 50ppm/C Molded SMD SMD Waffle Pack

Volume Production

Package/Case: 2010

Contact Plating: Tin, Silver

Max Operating Temperature: 155°C

Min Operating Temperature: -55°C

P2010E1001BN

Res Thin Film 2010 1K Ohm 0.1% 1W 25ppm/C Molded SMD SMD Waffle Pack

Not Recommended for New Design

Package/Case: 2010

Contact Plating: Tin, Silver

Max Operating Temperature: 155°C

Min Operating Temperature: -55°C

P2010Z3004FN

Res Thin Film 2010 3M Ohm 1% 1W 5ppm/C Molded SMD SMD Waffle Pack