A20-OLinuXino-LIME Rev I-BOM (e16GB)
Detailed Bill of Materials for the A20-OLinuXino-LIME single-board computer, Revision I, featuring the Allwinner A20 SoC and 16GB eMMC storage.
Overview
This document is the official Bill of Materials (BOM) for the A20-OLinuXino-LIME Revision I hardware, specifically for the version equipped with 16GB of eMMC storage. It lists all surface-mount and through-hole components, including the Allwinner A20 dual-core processor, Samsung DDR3 RAM, 16GB Samsung eMMC, and the X-Powers AXP209 Power Management Unit. Additional key components listed include the Microchip LAN8710A Ethernet controller, Silergy voltage regulators, and various connectors for HDMI, SATA, USB, and GPIO expansion.
Use Cases
- PCB assembly and manufacturing
- Component sourcing and procurement
- Hardware repair and troubleshooting
- Design validation for the A20-OLinuXino-LIME platform
Topics
Referenced Parts
AP1231-2.5V
Diodes Inc
1 AP1231-2.5V(SOT23-5) AP1231-33 VR1
BC846B
Generic
1 BC846B NPN-TRANSISTOR_SOT23 T1
BSS138
Generic
1 BSS138(SOT23-3) N-MOS+DIODBSS138(SOT23-3) FET4
IRLML6402
Infineon
3 IRLML6402 P-MOS+DIODIRLML6402 FET1, FET2, FET3
MCP121T-475I/TT
Microchip
1 MCP121T-475I/TT RESETMCP130T-300-I/TT U20
MT29F64G08CBABAWP
Micron
MT29F64G08CBABAWP:BTR(8GB_NAND))
FSMD035
Polytronics
1 FSMD035 FUSE FUSE1
RJLBC-060TC1
RJLBC
1 RJLBC-060TC1 RJLBC-060TC1_GND_MILLING LAN
H27UBG8T2A
SK Hynix
1 H27UBG8T2A U4
K4B4G1646D-BCK0
Samsung
1 K4B4G1646D-BCK0 U1
KLMAG2GEND-B031
Samsung
1 KLMAG2GEND-B031(FBGA153) FBGA153 U21
MC-306
Seiko Epson
1 Q32.768kHz/12.5pF/2P/SMD1206 MC-306_MC-306-TEST Q2
RCLAMP0524P
Semtech
3 NA(RCLAMP0524P) RCLAMP0524PTEST U5, U6, U8
SY6280
Silergy
3 SY6280(SOT23-5) SY6280 U9, U10, U11
SY8089AAAC
Silergy
2 SY8089AAAC(SOT23-5) SY8008 U13, U15
AXP209
X-Powers
1 AXP209(QFN48) AXP209 U12
H5TQ2G63BFR
SK Hynix
H5TQ2G63BFR_
| AT24C16C-SSHM-T | Microchip | 1 AT24C16C-SSHM-T(SOIC-8) 24LCXX U3 |
| LAN8710A-EZC | Microchip | 1 LAN8710A-EZC(QFN-32) LAN8710A-EZC U2 |
| NR3015T2R2M | Taiyo Yuden | 6 2.2uH/NR3015T2R2M/1.5A/3015 L-CD32 L10, L11, L12, L13, L14, L15 |
| W25Q128FVSIG | Winbond | 1 NA(W25Q128FVSIG) W25Q16BVSSIG(SO-8) U22 |
| MT3608 | Aerosemi | 1 MT3608(SOT23-6) SY7208 U14 |
| SMBJ6.0A | Generic | 1 SMBJ6.0A SMBJ16A D4 |
| A20 | Allwinner | 1 A20 A10 U7 |
| 1N4148 | Generic | 1 1N4148/SOD80C DSMD D6 |
| 1N5819 | Generic | 2 1N5819(S4SOD-123) D1, D2 |
| 1N5822 | Generic | 1 1N5822/SS34/SMA D-MLL-41 D5 |
| AP1231-2.5V | Diodes Inc | 1 AP1231-2.5V(SOT23-5) AP1231-33 VR1 |
| BC846B | Generic | 1 BC846B NPN-TRANSISTOR_SOT23 T1 |
| BSS138 | Generic | 1 BSS138(SOT23-3) N-MOS+DIODBSS138(SOT23-3) FET4 |
| IRLML6402 | Infineon | 3 IRLML6402 P-MOS+DIODIRLML6402 FET1, FET2, FET3 |
| MCP121T-475I/TT | Microchip | 1 MCP121T-475I/TT RESETMCP130T-300-I/TT U20 |
| MT29F64G08CBABAWP | Micron | MT29F64G08CBABAWP:BTR(8GB_NAND)) |
| FSMD035 | Polytronics | 1 FSMD035 FUSE FUSE1 |
| RJLBC-060TC1 | RJLBC | 1 RJLBC-060TC1 RJLBC-060TC1_GND_MILLING LAN |
| H27UBG8T2A | SK Hynix | 1 H27UBG8T2A U4 |
| K4B4G1646D-BCK0 | Samsung | 1 K4B4G1646D-BCK0 U1 |
| KLMAG2GEND-B031 | Samsung | 1 KLMAG2GEND-B031(FBGA153) FBGA153 U21 |
| MC-306 | Seiko Epson | 1 Q32.768kHz/12.5pF/2P/SMD1206 MC-306_MC-306-TEST Q2 |
| RCLAMP0524P | Semtech | 3 NA(RCLAMP0524P) RCLAMP0524PTEST U5, U6, U8 |
| SY6280 | Silergy | 3 SY6280(SOT23-5) SY6280 U9, U10, U11 |
| SY8089AAAC | Silergy | 2 SY8089AAAC(SOT23-5) SY8008 U13, U15 |
| AXP209 | X-Powers | 1 AXP209(QFN48) AXP209 U12 |
| H5TQ2G63BFR | SK Hynix | H5TQ2G63BFR_ |