Search Results for &quot; M24M02-DRCS6TP/K &quot;

2Mbit Serial I2C EEPROM, 1.8-5.5V, 85C, R-PBGA-B8

VFBGA, BGA8(UNSPEC)

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24256-DRCS6TP/K

256Kbit Serial-I2C EEPROM, 32Kx8, 1.8-5.5V, WLCSP, 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95M02-DRCS6TP/K

2Mbit Serial SPI EEPROM, 1.8-5.5V, 8-Pin, Industrial

VFBGA, BGA8(UNSPEC)

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M95512-DRCS6TP/K

512Kb Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DRCS6TG/K

256Kbit I2C EEPROM, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M02-DRMN6TP

2Mb I2C EEPROM, 1MHz, 450ns Access, SO Package

SOP, SOP8,.25

Active

Access Time-Max: 450ns

Package/Case: SO

Density: 2Mb

Frequency: 1MHz

+23

M24256-DRCS6P/K

256Kbit Serial-I2C EEPROM, 32Kx8, 1.8-5.5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M02-DWMN3TP/K

2-Mbit Serial I2C EEPROM, 1MHz, 8-Pin, Automotive

SOP, SOP8,.24

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95512-DRCS6P/K

512Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DRCS6G/K

512Kb Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M01-RMW6TG

1Mb I2C EEPROM, 1MHz, SOIC, 1.8-5.5V

0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Obsolete

Access Time: 500ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 1Mb

M24M01-RMN6TP

1Mb I2C EEPROM, 1MHz, SOIC, 5.5V

SOP, SOP8,.25

Active

Access Time: 500ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 1Mb

M24M01-RMN6P

1Mb I2C EEPROM, 400kHz, SOIC, 1.8-5.5V

SOP-8

Active

Access Time: 900ns

Access Time-Max: 500ns

Package/Case: SOIC

Density: 1Mb

+26

M24M01-RMW6G

1Mb I2C EEPROM, 400kHz, 500ns Access, SOIC, 1.8-5.5V

SOP, SOP8,.3

Obsolete

Access Time: 500ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 1Mb

+22

M24M01-DFDW6TP

1Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-RCS6TP/A

IC,SERIAL EEPROM,128KX8,CMOS,BGA,8PIN,PLASTIC

S-PBGA-B8

Obsolete

Access Time: 500ns

Access Time-Max: 500ns

Density: 1Mb

Frequency: 1MHz

+16

M24M01-HRMN6P

256KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP, SOP8,.25

Obsolete

Access Time: 500ns

Access Time-Max: 500ns

Package/Case: SOIC

Density: 1Mb

+18

M24M01-RDW6TP

1Mbit Serial I2C EEPROM, 1.8-5.5V, 8-Pin PDSO

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-DWDW3TP/K

1Mbit Serial I2C EEPROM, 1MHz, 2.5-5.5V, 8-Pin, Automotive

TSSOP,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-DFMN6TP

1Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO-G8, Industrial

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

Search Results for "M24M02-DRCS6TP/K"

Filters

M24M02-DRCS6TP/K

2Mbit Serial I2C EEPROM, 1.8-5.5V, 85C, R-PBGA-B8

VFBGA, BGA8(UNSPEC)

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24256-DRCS6TP/K

256Kbit Serial-I2C EEPROM, 32Kx8, 1.8-5.5V, WLCSP, 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95M02-DRCS6TP/K

2Mbit Serial SPI EEPROM, 1.8-5.5V, 8-Pin, Industrial

VFBGA, BGA8(UNSPEC)

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M95512-DRCS6TP/K

512Kb Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DRCS6TG/K

256Kbit I2C EEPROM, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M02-DRMN6TP

2Mb I2C EEPROM, 1MHz, 450ns Access, SO Package

SOP, SOP8,.25

Active

Access Time-Max: 450ns

Package/Case: SO

Density: 2Mb

Frequency: 1MHz

+23

M24256-DRCS6P/K

256Kbit Serial-I2C EEPROM, 32Kx8, 1.8-5.5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M02-DWMN3TP/K

2-Mbit Serial I2C EEPROM, 1MHz, 8-Pin, Automotive

SOP, SOP8,.24

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95512-DRCS6P/K

512Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DRCS6G/K

512Kb Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M01-RMW6TG

1Mb I2C EEPROM, 1MHz, SOIC, 1.8-5.5V

0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Obsolete

Access Time: 500ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 1Mb

M24M01-RMN6TP

1Mb I2C EEPROM, 1MHz, SOIC, 5.5V

SOP, SOP8,.25

Active

Access Time: 500ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 1Mb

M24M01-RMN6P

1Mb I2C EEPROM, 400kHz, SOIC, 1.8-5.5V

SOP-8

Active

Access Time: 900ns

Access Time-Max: 500ns

Package/Case: SOIC

Density: 1Mb

+26

M24M01-RMW6G

1Mb I2C EEPROM, 400kHz, 500ns Access, SOIC, 1.8-5.5V

SOP, SOP8,.3

Obsolete

Access Time: 500ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 1Mb

+22

M24M01-DFDW6TP

1Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-RCS6TP/A

IC,SERIAL EEPROM,128KX8,CMOS,BGA,8PIN,PLASTIC

S-PBGA-B8

Obsolete

Access Time: 500ns

Access Time-Max: 500ns

Density: 1Mb

Frequency: 1MHz

+16

M24M01-HRMN6P

256KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP, SOP8,.25

Obsolete

Access Time: 500ns

Access Time-Max: 500ns

Package/Case: SOIC

Density: 1Mb

+18

M24M01-RDW6TP

1Mbit Serial I2C EEPROM, 1.8-5.5V, 8-Pin PDSO

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-DWDW3TP/K

1Mbit Serial I2C EEPROM, 1MHz, 2.5-5.5V, 8-Pin, Automotive

TSSOP,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-DFMN6TP

1Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO-G8, Industrial

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL