Search Results for &quot; 3 145 917 Schurter &quot;

i.MX25 SoC, ARM926EJ-S, 400MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Lead Shape: Ball

M95128-DWMC4TP/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 20MHz, 8-Pin UFDFPN SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-WMC4P/K

128Kbit Serial-SPI EEPROM, 20MHz, 8-Pin UFDFPN EP, 3.3V/5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

HE24-1A83-220

Reed Relay 24VDC 1.05KOhm 3A SPST-NO(65x14.5x15.5)mm THT Dry

Through Hole

Active

Mounting: Through Hole

Termination Style: PC Pin

Number of Terminals: 3

Product Length (mm): 65

HE06-1A69

Reed Relay 6VDC 40Ohm 3A SPST-NO(65x14.5x15.5)mm THT Dry

Through Hole

Active

Mounting: Through Hole

Termination Style: PC Pin

Number of Terminals: 4

Product Length (mm): 65

FXLA101L6X

Onsemi

Voltage Level Translator 1-CH Bidirectional 6-Pin MicroPak W T/R

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: MicroPak

Package/Case: MicroPak W

Lead Shape: No Lead

Distributor	Stock	37+	58+	130+	286+
Quest	8,000	$1.3175	$1.1594	$1.054	$0.975
Tme	0	-	-	-	-

MCIMX253CJM4

i.MX25 SoC ARM926EJ-S 400MHz 32-bit 128KB RAM 400-Pin BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Lead Shape: Ball

74AHC2G126DP-Q100H

Dual 2-Port Bus Driver, 5V, 14.5ns Propagation Delay, AEC-Q100, TSSOP-8

TSSOP,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

HE24-1A69-03

4-Pin SPST-NO Reed Relay, 24VDC, 51.6mA, 465 Ohms, 15KVDC Isolation

Through Hole

Active

Mounting: Through Hole

Termination Style: PC Pin

Number of Terminals: 4

Product Length (mm): 65

M95512-DWDW4TP/K

512Kbit SPI EEPROM, 10MHz, 2.5-5.5V, 8-Pin, Automotive

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 145

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

MCIMX251AJM4

i.MX25 SoC, ARM926EJ-S, 400MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

M95128-DWDW4G/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

TPS7A4701QRGWRQ1

Texas Instruments

Adjustable Linear Voltage Regulator, 1.4V to 34V, 1A, AEC-Q100, VQFN-20

VQFN-20

Active

Max Operating Temperature: 125

Number of Terminals: 20

Min Operating Temperature: -40

Terminal Position: QUAD

Distributor	Stock	0+	1+	5+	25+
Quest	1,760	$0	-	-	-
Tme	0	-	$6.72	$6.04	$5.17

M95128-DWMC4G/K

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 3.3V/5V, 20MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-WMC4TP/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 20MHz, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

HE24-1A83

4-Pin Through Hole Reed Relay, 24V 22.86mA 1.05Kohm

Through Hole

Active

Mounting: Through Hole

Termination Style: PC Pin

Number of Terminals: 4

Product Length (mm): 65

74AHC2G125DP-Q100H

Dual 5V 2-Port Bus Driver, 14.5ns Propagation Delay, AEC-Q100, TSSOP-8

TSSOP,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

74VHC126BQ-Q100X

Quad Bus Driver, 14-Pin VQCCN, 2-5.5V, -40-125°C, AEC-Q100

VQCCN,

Active

Max Operating Temperature: 125

Number of Terminals: 14

Min Operating Temperature: -40

Terminal Position: QUAD

MCIMX27MJP4A

SoC i.MX21 ARM926EJ-S 400MHz 473-Pin MAP-BGA 0.09um

Ball Grid Array

NRND

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

M95128-WDW4TP/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

Search Results for "3 145 917 Schurter"

Filters

MCIMX253DJM4

i.MX25 SoC, ARM926EJ-S, 400MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Lead Shape: Ball

M95128-DWMC4TP/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 20MHz, 8-Pin UFDFPN SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-WMC4P/K

128Kbit Serial-SPI EEPROM, 20MHz, 8-Pin UFDFPN EP, 3.3V/5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

HE24-1A83-220

Reed Relay 24VDC 1.05KOhm 3A SPST-NO(65x14.5x15.5)mm THT Dry

Through Hole

Active

Mounting: Through Hole

Termination Style: PC Pin

Number of Terminals: 3

Product Length (mm): 65

HE06-1A69

Reed Relay 6VDC 40Ohm 3A SPST-NO(65x14.5x15.5)mm THT Dry

Through Hole

Active

Mounting: Through Hole

Termination Style: PC Pin

Number of Terminals: 4

Product Length (mm): 65

FXLA101L6X

Onsemi

Voltage Level Translator 1-CH Bidirectional 6-Pin MicroPak W T/R

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: MicroPak

Package/Case: MicroPak W

Lead Shape: No Lead

Distributor	Stock	37+	58+	130+	286+
Quest	8,000	$1.3175	$1.1594	$1.054	$0.975
Tme	0	-	-	-	-

MCIMX253CJM4

i.MX25 SoC ARM926EJ-S 400MHz 32-bit 128KB RAM 400-Pin BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Lead Shape: Ball

74AHC2G126DP-Q100H

Dual 2-Port Bus Driver, 5V, 14.5ns Propagation Delay, AEC-Q100, TSSOP-8

TSSOP,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

HE24-1A69-03

4-Pin SPST-NO Reed Relay, 24VDC, 51.6mA, 465 Ohms, 15KVDC Isolation

Through Hole

Active

Mounting: Through Hole

Termination Style: PC Pin

Number of Terminals: 4

Product Length (mm): 65

M95512-DWDW4TP/K

512Kbit SPI EEPROM, 10MHz, 2.5-5.5V, 8-Pin, Automotive

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 145

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

MCIMX251AJM4

i.MX25 SoC, ARM926EJ-S, 400MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

M95128-DWDW4G/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

TPS7A4701QRGWRQ1

Texas Instruments

Adjustable Linear Voltage Regulator, 1.4V to 34V, 1A, AEC-Q100, VQFN-20

VQFN-20

Active

Max Operating Temperature: 125

Number of Terminals: 20

Min Operating Temperature: -40

Terminal Position: QUAD

Distributor	Stock	0+	1+	5+	25+
Quest	1,760	$0	-	-	-
Tme	0	-	$6.72	$6.04	$5.17

M95128-DWMC4G/K

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 3.3V/5V, 20MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-WMC4TP/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 20MHz, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

HE24-1A83

4-Pin Through Hole Reed Relay, 24V 22.86mA 1.05Kohm

Through Hole

Active

Mounting: Through Hole

Termination Style: PC Pin

Number of Terminals: 4

Product Length (mm): 65

74AHC2G125DP-Q100H

Dual 5V 2-Port Bus Driver, 14.5ns Propagation Delay, AEC-Q100, TSSOP-8

TSSOP,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

74VHC126BQ-Q100X

Quad Bus Driver, 14-Pin VQCCN, 2-5.5V, -40-125°C, AEC-Q100

VQCCN,

Active

Max Operating Temperature: 125

Number of Terminals: 14

Min Operating Temperature: -40

Terminal Position: QUAD

MCIMX27MJP4A

SoC i.MX21 ARM926EJ-S 400MHz 473-Pin MAP-BGA 0.09um

Ball Grid Array

NRND

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

M95128-WDW4TP/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin TSSOP