26-Contact HDR Board Stacker, 2-Row, 2mm Pitch, Through Hole Mount
50-Contact Unshrouded HDR Header, 2.54mm Pitch, Through Hole Mount
20-Contact Unshrouded Header, HDR, 2mm Pitch, 2-Row, Through Hole Mount
80-Contact HDR Board Stacker, 1.27mm Pitch, 2 Rows, Surface Mount
3-Contact HDR Board Stacker, 2mm Pitch, 1 Row, Solder Termination
HDR 8-Contact Board Stacker, -55°C to 105°C, Through Hole Mount
3-Contact HDR Board Stacker, 2mm Pitch, Through Hole Mount, -55 to 105°C
Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Top Entry Thru-Hole
Conn Unshrouded Header HDR 40 POS 2.54mm Solder ST Top Entry Thru-Hole
Unshrouded 2-Contact 2mm Pitch HDR Header, -55°C to 125°C, Through Hole Mount
32-BIT, 800MHz, RISC PROCESSOR, PBGA689, 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, WBTEBGAII-689
689-Pin RISC Microprocessor, 800 MHz, 32-Bit, 1.05V, WBTEBGAII-689
18-Contact Unshrouded HDR Header, 2.54mm Pitch, Through Hole Mount
Unshrouded 50-Contact HDR Header, 2.54mm Pitch, Through Hole Mount
Conn Board Stacker HDR 4 POS 2mm Solder ST Thru-Hole
Conn Board Stacker HDR 2 POS 2mm Solder ST Thru-Hole
246-Contact Elevated Socket, SKT, 2mm Pitch, Through Hole Mount, -55°C to 125°C
Industrial-Grade FPGA, 1.15-1.25V, 416MHz, 246 Inputs/Outputs, 324-Pin UBGA
324-Pin BGA FPGA, 2.375-2.625V, 246 I/O Lines
Intel Field-Programmable Gate Array, Industrial Temperature, 3V, 324-Pin UBGA
