Search Results for &quot; MCIMX31CJKN5D &quot;

ARM1136JF-S Microprocessor IC i.MX31 1 Core, 32-Bit 532MHz

End of Life

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+16

MCIMX31LCVKN5DR2

IC,TV/VIDEO CIRCUIT,VIDEO PROCESSING/ENDEC FOR MPEG,BGA,457PIN,PLASTIC

FBGA, BGA457,26X26,20

Active

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

MCIMX31LCVMN4CR2

Processors - Application Specialized TORTOLA MX31 AUTO FULL

Obsolete

Package/Case: MAPBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+13

MCIMX31LDVKN5DR2

IC,TV/VIDEO CIRCUIT,VIDEO PROCESSING/ENDEC FOR MPEG,BGA,457PIN,PLASTIC

FBGA, BGA457,26X26,20

Active

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Max Operating Temperature: 70°C

+11

MCIMX31LDVMN5DR2

IC,TV/VIDEO CIRCUIT,VIDEO PROCESSING/ENDEC FOR MPEG,BGA,473PIN,PLASTIC

FBGA, BGA473,23X23,32

Active

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

MCIMX31LCVMN4DR2

ARM1136JF-S Microprocessor IC i.MX31 1 Core, 32-Bit 400MHz

Volume Production

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+15

MCIMX35WPDK

FREESCALE SEMICONDUCTOR MCIMX35WPDK I.MX35, WINCE 6.0, PRODUCT DEV KIT

Obsolete

Core Architecture: ARM

Evaluation Kit: Yes

Lead Free: Lead Free

Mount: Hardware

MCIMX35LPDK

Development Boards & Kits - ARM I.MX35 PRODUCT DEVELOPME

Not Recommended for New Design

Core Architecture: ARM

Evaluation Kit: Yes

Interface: USB, CAN, Ethernet

Number of Bits: 32

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX351AVM4B

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX353CJQ5C

400-Pin PBGA Industrial Microprocessor IC, 17x17mm

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX355AJM5B

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 400-Pin BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 128KB RAM 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX357CVM5B

SPECIALTY CONSUMER CIRCUIT, PBGA400

LFBGA, BGA400,20X20,32

Active

Max Operating Temperature: 85

Number of Terminals: 400

Min Operating Temperature: -40

Terminal Position: BOTTOM

+10

MCIMX356AJQ5C

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX355AVM5B

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX355AVM4B

i.MX35 32-bit MPU, ARM1136JF-S core, 400MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX357CJQ5C

32-bit MPU, ARM1136JF-S, 532MHz, 400-Pin PBGA, Industrial

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

Search Results for "MCIMX31CJKN5D"

Filters

MCIMX31DVKN5DR2

ARM1136JF-S Microprocessor IC i.MX31 1 Core, 32-Bit 532MHz

End of Life

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+16

MCIMX31LCVKN5DR2

IC,TV/VIDEO CIRCUIT,VIDEO PROCESSING/ENDEC FOR MPEG,BGA,457PIN,PLASTIC

FBGA, BGA457,26X26,20

Active

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

MCIMX31LCVMN4CR2

Processors - Application Specialized TORTOLA MX31 AUTO FULL

Obsolete

Package/Case: MAPBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+13

MCIMX31LDVKN5DR2

IC,TV/VIDEO CIRCUIT,VIDEO PROCESSING/ENDEC FOR MPEG,BGA,457PIN,PLASTIC

FBGA, BGA457,26X26,20

Active

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Max Operating Temperature: 70°C

+11

MCIMX31LDVMN5DR2

IC,TV/VIDEO CIRCUIT,VIDEO PROCESSING/ENDEC FOR MPEG,BGA,473PIN,PLASTIC

FBGA, BGA473,23X23,32

Active

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

MCIMX31LCVMN4DR2

ARM1136JF-S Microprocessor IC i.MX31 1 Core, 32-Bit 400MHz

Volume Production

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+15

MCIMX35WPDK

FREESCALE SEMICONDUCTOR MCIMX35WPDK I.MX35, WINCE 6.0, PRODUCT DEV KIT

Obsolete

Core Architecture: ARM

Evaluation Kit: Yes

Lead Free: Lead Free

Mount: Hardware

MCIMX35LPDK

Development Boards & Kits - ARM I.MX35 PRODUCT DEVELOPME

Not Recommended for New Design

Core Architecture: ARM

Evaluation Kit: Yes

Interface: USB, CAN, Ethernet

Number of Bits: 32

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX351AVM4B

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX353CJQ5C

400-Pin PBGA Industrial Microprocessor IC, 17x17mm

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX355AJM5B

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 400-Pin BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 128KB RAM 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX357CVM5B

SPECIALTY CONSUMER CIRCUIT, PBGA400

LFBGA, BGA400,20X20,32

Active

Max Operating Temperature: 85

Number of Terminals: 400

Min Operating Temperature: -40

Terminal Position: BOTTOM

+10

MCIMX356AJQ5C

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX355AVM5B

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX355AVM4B

i.MX35 32-bit MPU, ARM1136JF-S core, 400MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX357CJQ5C

32-bit MPU, ARM1136JF-S, 532MHz, 400-Pin PBGA, Industrial