Search Results for &quot; NCP2811AMTTXG &quot;

Audio Amp Headphone 2-CH Stereo 0.11W Class-AB 12-Pin WQFN EP T/R

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: WQFN EP

Package Description: Very Very Thin Quad Flat No Lead Package, Exposed Pad

NCP2811AMTTXGEVB

Evaluation Board For Designed For Portable Communication Device Applications Such As Mobile Phones

Volume Production

Evaluation Kit: Yes

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Output Power: 110mW

NCP2811ADTBR2G

Audio Amp Headphone 2-CH Stereo 0.11W Class-AB 14-Pin TSSOP W T/R

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP W

Package Description: Thin Shrink Small Outline Package

+19

NCP2811AFCT1G

Audio Amp Headphone 2-CH Stereo 0.11W Class-AB 12-Pin Flip-Chip T/R

Ball Grid Array

LTB

Basic Package Type: Ball Grid Array

Package Family Name: Flip-Chip

Package/Case: Flip-Chip

Package Description: Flip Chip Package

NCP2811AFCT1GEVB

Evaluation Board For Designed For Portable Communication Device Applications Such As Mobile Phones

Volume Production

Evaluation Kit: Yes

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Output Power: 110mW

NCP2811ADTBRGEVB

Evaluation Board For Designed For Portable Communication Device Applications Such As Mobile Phones

Volume Production

Evaluation Kit: Yes

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Output Power: 110mW

NCP2811BMTTXG

Audio Amp Headphone 2-CH Stereo 0.11W Class-AB 12-Pin WQFN EP T/R

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: WQFN EP

Package Description: Very Very Thin Quad Flat No Lead Package, Exposed Pad

NCP2811BFCT1G

Audio Amp Headphone 2-CH Stereo 0.11W Class-AB 12-Pin Flip-Chip T/R

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: Flip-Chip

Package/Case: Flip-Chip

Package Description: Flip Chip Package

NCP2811BDTBR2G

Audio Amp Headphone 2-CH Stereo 0.11W Class-AB 14-Pin TSSOP W T/R

Lead-Frame SMT

LTB

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP W

Package Description: Thin Shrink Small Outline Package

BOARD EVAL NCP2811

Volume Production

Evaluation Kit: Yes

Max Output Power: 110mW

Packaging: Bulk

Radiation Hardening: No

NCP2811BFCT1GEVB

BOARD EVAL NCP2811

Volume Production

Evaluation Kit: Yes

Max Output Power: 110mW

Packaging: Bulk

Radiation Hardening: No

NCP2811BDTBRGEVB

BOARD EVAL NCP2811

Volume Production

Evaluation Kit: Yes

Max Output Power: 110mW

Packaging: Bulk

Radiation Hardening: No

NCP2815BFCT2GEVB

BOARD EVAL FOR NCP2815

Volume Production

Evaluation Kit: Yes

Max Output Power: 62mW

Packaging: Bulk

Series: NOCAP™

NCP2892AEVB

EVAL BOARD FOR NCP2892A

Obsolete

Max Output Power: 1.3W

Operating Supply Voltage: 5V

Output Power: 1.3W

Package Quantity: 1

NCP2890EVB

EVAL BOARD FOR NCP2890

Obsolete

Evaluation Kit: Yes

Max Output Power: 1.08W

Operating Supply Voltage: 5.5V

Output Power: 1W

NCP2820EVB

BOARD EVAL NCP2820

Obsolete

Max Output Power: 2.65W

Packaging: Bulk

NCP2809AEVB

EVAL BOARD FOR NCP2809A

Volume Production

Max Output Power: 135mW

Operating Supply Voltage: 5.5V

Output Power: 135mW

Package Quantity: 1

NCP2823AGEVB

Audio IC Development Tools NCP2823A EVAL BOARD

Obsolete

Max Output Power: 1.8W

Operating Supply Voltage: 5V

Package Quantity: 1

Packaging: Box

NCP2890DMR2

1.08W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO8, MICRO-8

TSSOP, TSSOP8,.19

Obsolete

Package/Case: MSOP

Lead Free: Contains Lead

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

+12

NCP2820FCT1

IC 2.63 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, FCSP-9, Audio/Video Amplifier

FCSP-9

Obsolete

Lead Free: Contains Lead

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Output Power: 2.65W

+10

Search Results for "NCP2811AMTTXG"

Filters

NCP2811AMTTXG

Audio Amp Headphone 2-CH Stereo 0.11W Class-AB 12-Pin WQFN EP T/R

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: WQFN EP

Package Description: Very Very Thin Quad Flat No Lead Package, Exposed Pad

NCP2811AMTTXGEVB

Evaluation Board For Designed For Portable Communication Device Applications Such As Mobile Phones

Volume Production

Evaluation Kit: Yes

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Output Power: 110mW

NCP2811ADTBR2G

Audio Amp Headphone 2-CH Stereo 0.11W Class-AB 14-Pin TSSOP W T/R

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP W

Package Description: Thin Shrink Small Outline Package

+19

NCP2811AFCT1G

Audio Amp Headphone 2-CH Stereo 0.11W Class-AB 12-Pin Flip-Chip T/R

Ball Grid Array

LTB

Basic Package Type: Ball Grid Array

Package Family Name: Flip-Chip

Package/Case: Flip-Chip

Package Description: Flip Chip Package

NCP2811AFCT1GEVB

Evaluation Board For Designed For Portable Communication Device Applications Such As Mobile Phones

Volume Production

Evaluation Kit: Yes

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Output Power: 110mW

NCP2811ADTBRGEVB

Evaluation Board For Designed For Portable Communication Device Applications Such As Mobile Phones

Volume Production

Evaluation Kit: Yes

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Output Power: 110mW

NCP2811BMTTXG

Audio Amp Headphone 2-CH Stereo 0.11W Class-AB 12-Pin WQFN EP T/R

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: WQFN EP

Package Description: Very Very Thin Quad Flat No Lead Package, Exposed Pad

NCP2811BFCT1G

Audio Amp Headphone 2-CH Stereo 0.11W Class-AB 12-Pin Flip-Chip T/R

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: Flip-Chip

Package/Case: Flip-Chip

Package Description: Flip Chip Package

NCP2811BDTBR2G

Audio Amp Headphone 2-CH Stereo 0.11W Class-AB 14-Pin TSSOP W T/R

Lead-Frame SMT

LTB

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP W

Package Description: Thin Shrink Small Outline Package

BOARD EVAL NCP2811

Volume Production

Evaluation Kit: Yes

Max Output Power: 110mW

Packaging: Bulk

Radiation Hardening: No

NCP2811BFCT1GEVB

BOARD EVAL NCP2811

Volume Production

Evaluation Kit: Yes

Max Output Power: 110mW

Packaging: Bulk

Radiation Hardening: No

NCP2811BDTBRGEVB

BOARD EVAL NCP2811

Volume Production

Evaluation Kit: Yes

Max Output Power: 110mW

Packaging: Bulk

Radiation Hardening: No

NCP2815BFCT2GEVB

BOARD EVAL FOR NCP2815

Volume Production

Evaluation Kit: Yes

Max Output Power: 62mW

Packaging: Bulk

Series: NOCAP™

NCP2892AEVB

EVAL BOARD FOR NCP2892A

Obsolete

Max Output Power: 1.3W

Operating Supply Voltage: 5V

Output Power: 1.3W

Package Quantity: 1

NCP2890EVB

EVAL BOARD FOR NCP2890

Obsolete

Evaluation Kit: Yes

Max Output Power: 1.08W

Operating Supply Voltage: 5.5V

Output Power: 1W

NCP2820EVB

BOARD EVAL NCP2820

Obsolete

Max Output Power: 2.65W

Packaging: Bulk

NCP2809AEVB

EVAL BOARD FOR NCP2809A

Volume Production

Max Output Power: 135mW

Operating Supply Voltage: 5.5V

Output Power: 135mW

Package Quantity: 1

NCP2823AGEVB

Audio IC Development Tools NCP2823A EVAL BOARD

Obsolete

Max Output Power: 1.8W

Operating Supply Voltage: 5V

Package Quantity: 1

Packaging: Box

NCP2890DMR2

1.08W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO8, MICRO-8

TSSOP, TSSOP8,.19

Obsolete

Package/Case: MSOP

Lead Free: Contains Lead

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

+12

NCP2820FCT1

IC 2.63 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, FCSP-9, Audio/Video Amplifier