Search Results for &quot; TPS6590376ZWST &quot;

Power Mgmt IC: 3 DC/DC, 4 LDO, USB HS, 1.2A, 4.5V, LFBGA

NFBGA-139

Active

Package/Case: LFBGA

Height: 0.89mm

Lead Free: Lead Free

Length: 10mm

+23

TPS65930A2ZCH

PMIC, 4.5V, 7 Outputs, 1.2A, LFBGA, Surface Mount

BGA

Active

Package/Case: LFBGA

Current: 1.2A

Height: 0.89mm

Lead Free: Lead Free

+17

TPS65921B1ZQZ

Integrated Power Management IC (PMIC) with 3 DC/DC''s, 4 LDOs, USB HS Transceiver 120-BGA MICROSTAR JUNIOR -40 to 85

BGA-120

Obsolete

Package/Case: VFBGA

Lead Free: Lead Free

Length: 6mm

Max Duty Cycle: 55%

TPS65930BZCHR

Integrated Power Management IC (PMIC) with 3 DC/DC''s, 4 LDO''s, Audio Codec, USB HS Transceiver 139-NFBGA -40 to 85

LFBGA,

Obsolete

Package/Case: LFBGA

Height: 0.89mm

Lead Free: Contains Lead

Length: 10mm

TPS659161RGZR

Power Management Unit (PMU) for Processor 48-VQFN -40 to 105

HVQCCN,

Not Recommended

Max Operating Temperature: 105

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: QUAD

TPS659127YFFT

Power Management IC (PMIC) with 4DC/DCs, 10 LDOs, 3 LED outputs & 32kHz RC oscillator 81-DSBGA -40 to 85

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 81

Min Operating Temperature: -40

Terminal Position: BOTTOM

TPS659121YFFR

Application Processors 2.7V to 5.5V 81-Pin DSBGA T/R

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: DSBGA

Package Description: Die Size Ball Grid Array

TPS65950BZXNR

Integrated Power Management IC (PMIC) with 3 DC/DCs, 11 LDOs, Audio Codec, USB HS Transceiver 209-NFBGA -40 to 85

VFBGA,

Obsolete

Package/Case: BGA

Height: 0.68mm

Lead Free: Contains Lead

Length: 7mm

HVQCCN,

Obsolete

Max Operating Temperature: 105

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: QUAD

TPS659122YFFR

Application Processors 2.7V to 5.5V 81-Pin DSBGA T/R

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: DSBGA

Package Description: Die Size Ball Grid Array

TPS659127YFFR

Application Processors 2.7V to 5.5V 81-Pin DSBGA T/R

BGA

Active

Max Operating Temperature: 85

Number of Terminals: 81

Min Operating Temperature: -40

Terminal Position: BOTTOM

TPS65910EVM-583

Power Management IC Development Tools TPS65910 EVAL MOD

Volume Production

Package/Case: Module

Evaluation Kit: Yes

Interface: I2C, USB

Lead Free: Lead Free

TPS659163RGZT

Power Management Unit (PMU) for Processor 48-VQFN -40 to 105

HVQCCN,

Active

Max Operating Temperature: 105

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: QUAD

TPS65910A1RSL

Power Management IC: 4 DC/DC, 8 LDOs, RTC, 5.5V, 1.7A, VQFN

HVQCCN, LCC48,.24SQ,16

Active

Package/Case: VQFN

Height: 0.9mm

Lead Free: Lead Free

Length: 6mm

+20

TPS65920BZCHR

Integrated Power Management IC (PMIC) with 3 DC/DC''s, 4 LDO''s, USB HS Transceiver 139-NFBGA -40 to 85

10 X 10 MM, 0.65 MM PITCH, GREEN, PLASTIC, NFBGA-139

Obsolete

Package/Case: LFBGA

Height: 0.89mm

Lead Free: Contains Lead

Length: 10mm

TPS659163RGZR

Power Management Unit (PMU) for Processor 48-VQFN -40 to 105

VQFN-48

Active

Max Operating Temperature: 105

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: QUAD

TPS659162RGZR

Power Management Unit (PMU) for Processor 48-VQFN -40 to 105

HVQCCN,

Active

Max Operating Temperature: 105

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: QUAD

TPS659122YFFT

Application Processors 2.7V to 5.5V 81-Pin DSBGA T/R

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: DSBGA

Package Description: Die Size Ball Grid Array

TPS659101A1RSL

OMAP3 Power Management 2.7V to 5.5V 48-Pin VQFN EP Tube

QFN

Active

Package/Case: VQFN EP

Height: 0.9mm

Lead Free: Lead Free

Length: 6mm

+13

TPS65950A2ZXNR

Integrated Power Management IC (PMIC) with 3 DC/DCs, 11 LDOs, Audio Codec, USB HS Transceiver 209-NFBGA -40 to 85

VFBGA,

Active

Package/Case: BGA

Height: 0.68mm

Lead Free: Lead Free

Length: 7mm

Search Results for "TPS6590376ZWST"

Filters

TPS65920A2ZCH

Power Mgmt IC: 3 DC/DC, 4 LDO, USB HS, 1.2A, 4.5V, LFBGA

NFBGA-139

Active

Package/Case: LFBGA

Height: 0.89mm

Lead Free: Lead Free

Length: 10mm

+23

TPS65930A2ZCH

PMIC, 4.5V, 7 Outputs, 1.2A, LFBGA, Surface Mount

BGA

Active

Package/Case: LFBGA

Current: 1.2A

Height: 0.89mm

Lead Free: Lead Free

+17

TPS65921B1ZQZ

Integrated Power Management IC (PMIC) with 3 DC/DC''s, 4 LDOs, USB HS Transceiver 120-BGA MICROSTAR JUNIOR -40 to 85

BGA-120

Obsolete

Package/Case: VFBGA

Lead Free: Lead Free

Length: 6mm

Max Duty Cycle: 55%

TPS65930BZCHR

Integrated Power Management IC (PMIC) with 3 DC/DC''s, 4 LDO''s, Audio Codec, USB HS Transceiver 139-NFBGA -40 to 85

LFBGA,

Obsolete

Package/Case: LFBGA

Height: 0.89mm

Lead Free: Contains Lead

Length: 10mm

TPS659161RGZR

Power Management Unit (PMU) for Processor 48-VQFN -40 to 105

HVQCCN,

Not Recommended

Max Operating Temperature: 105

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: QUAD

TPS659127YFFT

Power Management IC (PMIC) with 4DC/DCs, 10 LDOs, 3 LED outputs & 32kHz RC oscillator 81-DSBGA -40 to 85

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 81

Min Operating Temperature: -40

Terminal Position: BOTTOM

TPS659121YFFR

Application Processors 2.7V to 5.5V 81-Pin DSBGA T/R

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: DSBGA

Package Description: Die Size Ball Grid Array

TPS65950BZXNR

Integrated Power Management IC (PMIC) with 3 DC/DCs, 11 LDOs, Audio Codec, USB HS Transceiver 209-NFBGA -40 to 85

VFBGA,

Obsolete

Package/Case: BGA

Height: 0.68mm

Lead Free: Contains Lead

Length: 7mm

HVQCCN,

Obsolete

Max Operating Temperature: 105

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: QUAD

TPS659122YFFR

Application Processors 2.7V to 5.5V 81-Pin DSBGA T/R

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: DSBGA

Package Description: Die Size Ball Grid Array

TPS659127YFFR

Application Processors 2.7V to 5.5V 81-Pin DSBGA T/R

BGA

Active

Max Operating Temperature: 85

Number of Terminals: 81

Min Operating Temperature: -40

Terminal Position: BOTTOM

TPS65910EVM-583

Power Management IC Development Tools TPS65910 EVAL MOD

Volume Production

Package/Case: Module

Evaluation Kit: Yes

Interface: I2C, USB

Lead Free: Lead Free

TPS659163RGZT

Power Management Unit (PMU) for Processor 48-VQFN -40 to 105

HVQCCN,

Active

Max Operating Temperature: 105

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: QUAD

TPS65910A1RSL

Power Management IC: 4 DC/DC, 8 LDOs, RTC, 5.5V, 1.7A, VQFN

HVQCCN, LCC48,.24SQ,16

Active

Package/Case: VQFN

Height: 0.9mm

Lead Free: Lead Free

Length: 6mm

+20

TPS65920BZCHR

Integrated Power Management IC (PMIC) with 3 DC/DC''s, 4 LDO''s, USB HS Transceiver 139-NFBGA -40 to 85

10 X 10 MM, 0.65 MM PITCH, GREEN, PLASTIC, NFBGA-139

Obsolete

Package/Case: LFBGA

Height: 0.89mm

Lead Free: Contains Lead

Length: 10mm

TPS659163RGZR

Power Management Unit (PMU) for Processor 48-VQFN -40 to 105

VQFN-48

Active

Max Operating Temperature: 105

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: QUAD

TPS659162RGZR

Power Management Unit (PMU) for Processor 48-VQFN -40 to 105

HVQCCN,

Active

Max Operating Temperature: 105

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: QUAD

TPS659122YFFT

Application Processors 2.7V to 5.5V 81-Pin DSBGA T/R

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: DSBGA

Package Description: Die Size Ball Grid Array

TPS659101A1RSL

OMAP3 Power Management 2.7V to 5.5V 48-Pin VQFN EP Tube

QFN

Active

Package/Case: VQFN EP

Height: 0.9mm

Lead Free: Lead Free

Length: 6mm

+13

TPS65950A2ZXNR

Integrated Power Management IC (PMIC) with 3 DC/DCs, 11 LDOs, Audio Codec, USB HS Transceiver 209-NFBGA -40 to 85

VFBGA,

Active

Package/Case: BGA

Height: 0.68mm

Lead Free: Lead Free

Length: 7mm