Search Results for &quot; LPC1114FN28102,12 &quot;

NXP LPC1112FHN33/103 MCU, 32BIT, CORTEX-M0, 50MHZ, HVQFN-32

Volume Production

Package/Case: SOT-865-3

Frequency: 50MHz

Max Operating Temperature: 85°C

Memory Size: 16KB

+12

LPC1113FHN33/202

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33

Active

Frequency: 50MHz

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Supply Voltage: 3.6V

LPC1113FHN33/202:5

IC MCU 32BIT 24KB FLASH 32HVQFN

Volume Production

Core Architecture: ARM

Interface: I2C, SPI, UART, USART

Lead Free: Lead Free

Package Quantity: 4000

LPC1113FHN33/303,5

MCU 32-bit ARM Cortex M0 RISC 24KB Flash 3.3V 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

+38

LPC1112FDH28/102,5

32-bit ARM Cortex M0 MCU, 50MHz, 16KB Flash, 28-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

LPC1112FHI33/202,5

32-bit ARM Cortex M0 MCU, 50MHz, 16KB Flash, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1115FBD48/303,1

32-bit ARM Cortex M0 MCU, 64KB Flash, 50MHz, 48-Pin LQFP

Surface Mount

Active

Package/Case: LQFP

Pin Count: 48

PCB: 48

Package Length (mm): 7.1(Max)

LPC1113FBD48/303,1

32-bit ARM Cortex M0 MCU, 50MHz, 24KB Flash, 48-Pin LQFP

Surface Mount

Active

Package/Case: LQFP

Pin Count: 48

PCB: 48

Package Length (mm): 7.1(Max)

LPC1111FHN33/203

32-Bit RISC MCU, 50MHz, FLASH, 33-Pin, Industrial

HVQCCN,

Active

Max Operating Temperature: 85

Number of Terminals: 33

Min Operating Temperature: -40

Terminal Position: QUAD

LPC1113FHN33/203

32-Bit RISC MCU, 50MHz, FLASH, 33-Pin, Industrial

7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33

Active

Max Operating Temperature: 85

Number of Terminals: 33

Min Operating Temperature: -40

Terminal Position: QUAD

LPC1115JET48/303

IC RISC MICROCONTROLLER, Microcontroller

TFBGA-48

Active

Package/Case: TFBGA

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

+15

LPC1112FHN33/202

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

HVQCCN,

Active

Package/Case: SOT-865-3

Frequency: 50MHz

Max Supply Voltage: 3.6V

Memory Size: 16KB

LPC1112FDH20/102

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PDSO20, 4.40 MM HEIGHT, PLASTIC, SOT360-1, MO-153, TSSOP-20, Microcontroller

TSSOP,

Active

Package/Case: SOT-360-1

Number of ADC Channels: 5

Number of GPIO: 14

Number of Timers/Counters: 4

LPC1111JHN33/203E

LPC1111JHN33 - 8kB flash, 4kB SRAM, HVQFN32 package QFN 32-Pin

HVQCCN, LCC32,.27SQ,25

Active

Package/Case: VQFN

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

LPC1112JHN33/203E

32-bit ARM MCU 16KB Flash 50MHz 28 I/O HVQFN

Volume Production

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Interface: I2C, SPI, UART, USART

LPC1111JHN33/103E

32-bit ARM MCU, 25MHz, 8KB Flash, 2KB RAM, VQFN

Volume Production

Package/Case: VQFN

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

LPC1113JHN33/203E

32-bit ARM MCU, 25MHz, 24KB Flash, 4KB RAM, VQFN

Volume Production

Package/Case: VQFN

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

LPC1113JHN33/303E

MCU 32-bit LPC1100 ARM Cortex M0 RISC 24KB Flash 3.3V 33-Pin HVQFN EP Tray

Not Recommended for New Design

Package/Case: VQFN

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

LPC1113FHN33/302K

MCU 32-bit LPC1100L ARM Cortex M0 RISC 24KB Flash 3.3V 33-Pin HVQFN EP Tray

Obsolete

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

Max Frequency: 50MHz

+14

LPC1112FHN24/202J

32-bit MCU, 25MHz, 16KB Flash, 4KB RAM, 24-Pin HVQFN

HVQCCN, LCC24,.16SQ,20

Active

Max Operating Temperature: 85

Number of Terminals: 24

Min Operating Temperature: -40

Terminal Position: QUAD

Search Results for "LPC1114FN28102,12"

Filters

LPC1112FHN33/103

NXP LPC1112FHN33/103 MCU, 32BIT, CORTEX-M0, 50MHZ, HVQFN-32

Volume Production

Package/Case: SOT-865-3

Frequency: 50MHz

Max Operating Temperature: 85°C

Memory Size: 16KB

+12

LPC1113FHN33/202

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33

Active

Frequency: 50MHz

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Supply Voltage: 3.6V

LPC1113FHN33/202:5

IC MCU 32BIT 24KB FLASH 32HVQFN

Volume Production

Core Architecture: ARM

Interface: I2C, SPI, UART, USART

Lead Free: Lead Free

Package Quantity: 4000

LPC1113FHN33/303,5

MCU 32-bit ARM Cortex M0 RISC 24KB Flash 3.3V 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

+38

LPC1112FDH28/102,5

32-bit ARM Cortex M0 MCU, 50MHz, 16KB Flash, 28-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

LPC1112FHI33/202,5

32-bit ARM Cortex M0 MCU, 50MHz, 16KB Flash, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1115FBD48/303,1

32-bit ARM Cortex M0 MCU, 64KB Flash, 50MHz, 48-Pin LQFP

Surface Mount

Active

Package/Case: LQFP

Pin Count: 48

PCB: 48

Package Length (mm): 7.1(Max)

LPC1113FBD48/303,1

32-bit ARM Cortex M0 MCU, 50MHz, 24KB Flash, 48-Pin LQFP

Surface Mount

Active

Package/Case: LQFP

Pin Count: 48

PCB: 48

Package Length (mm): 7.1(Max)

LPC1111FHN33/203

32-Bit RISC MCU, 50MHz, FLASH, 33-Pin, Industrial

HVQCCN,

Active

Max Operating Temperature: 85

Number of Terminals: 33

Min Operating Temperature: -40

Terminal Position: QUAD

LPC1113FHN33/203

32-Bit RISC MCU, 50MHz, FLASH, 33-Pin, Industrial

7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33

Active

Max Operating Temperature: 85

Number of Terminals: 33

Min Operating Temperature: -40

Terminal Position: QUAD

LPC1115JET48/303

IC RISC MICROCONTROLLER, Microcontroller

TFBGA-48

Active

Package/Case: TFBGA

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

+15

LPC1112FHN33/202

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

HVQCCN,

Active

Package/Case: SOT-865-3

Frequency: 50MHz

Max Supply Voltage: 3.6V

Memory Size: 16KB

LPC1112FDH20/102

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PDSO20, 4.40 MM HEIGHT, PLASTIC, SOT360-1, MO-153, TSSOP-20, Microcontroller

TSSOP,

Active

Package/Case: SOT-360-1

Number of ADC Channels: 5

Number of GPIO: 14

Number of Timers/Counters: 4

LPC1111JHN33/203E

LPC1111JHN33 - 8kB flash, 4kB SRAM, HVQFN32 package QFN 32-Pin

HVQCCN, LCC32,.27SQ,25

Active

Package/Case: VQFN

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

LPC1112JHN33/203E

32-bit ARM MCU 16KB Flash 50MHz 28 I/O HVQFN

Volume Production

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Interface: I2C, SPI, UART, USART

LPC1111JHN33/103E

32-bit ARM MCU, 25MHz, 8KB Flash, 2KB RAM, VQFN

Volume Production

Package/Case: VQFN

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

LPC1113JHN33/203E

32-bit ARM MCU, 25MHz, 24KB Flash, 4KB RAM, VQFN

Volume Production

Package/Case: VQFN

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

LPC1113JHN33/303E

MCU 32-bit LPC1100 ARM Cortex M0 RISC 24KB Flash 3.3V 33-Pin HVQFN EP Tray

Not Recommended for New Design

Package/Case: VQFN

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

LPC1113FHN33/302K

MCU 32-bit LPC1100L ARM Cortex M0 RISC 24KB Flash 3.3V 33-Pin HVQFN EP Tray

Obsolete

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

Max Frequency: 50MHz

+14

LPC1112FHN24/202J

32-bit MCU, 25MHz, 16KB Flash, 4KB RAM, 24-Pin HVQFN

HVQCCN, LCC24,.16SQ,20

Active

Max Operating Temperature: 85

Number of Terminals: 24

Min Operating Temperature: -40

Terminal Position: QUAD