50-Contact Unshrouded Header, HDR, 2.54mm Pitch, Through Hole Mount
10-Contact Unshrouded HDR Header, 2.54mm Pitch, Through Hole Mount
4-Contact Unshrouded Header, HDR, 2.54mm Pitch, Through Hole Mount
16-Contact Unshrouded HDR Header, 2.54mm Pitch, Through Hole Mount
50-Contact Unshrouded HDR Header, 2.54mm Pitch, Through Hole Mount
Unshrouded 4-Contact 2.54mm Pitch HDR Header
8-Contact Unshrouded Header, HDR, 2.54mm Pitch, Through Hole Mount
20-Contact Unshrouded HDR Header, 2.54mm Pitch, Through Hole Mount
Unshrouded 6-Contact HDR Header, 2.54mm Pitch, Through Hole Mount, -55°C to 125°C
SAMTEC ICF-314-S-I IC & Component Socket, ICF Series, DIP Socket, 14 Contacts, 2.54 mm, 7.62 mm, Gold Plated Contacts
10Gb/s 10km single‑mode BiDi SFP+ transceiver, 1331 nm TX / 1271 nm RX, Simplex LC, −40 to +85 °C
Industrial-temp 10GBASE-SR SFP+ transceiver, 850 nm MMF, up to 400 m, LC, DOM
512GB NVMe M.2 2280 Flash SSD Module, Industrial TLC, -40°C to 85°C
1.65 GHz Clock Fanout Buffer with Output Dividers and Delay Adjust
50-Contact HDR Board Stacker Connector, 1.27mm Pitch, -55°C to 125°C
4-Position 2.54mm Pitch Surface Mount Header
Single-Contact Through-Hole Header, Black Tin Plated, 1 Position
8-Contact HDR Board Stacker Connector, 845VDC, 13.1A, Through Hole
Conn Board Stacker HDR 20 POS 2.54mm Solder ST Top Entry Thru-Hole Bulk
