FISCHER ELEKTRONIK ICK SMD B 13 SA Heat Sink, For SMD, 29 C/W, 4.8 mm, 19 mm, 13 mm
FISCHER ELEKTRONIK ICK BGA 27X27 Heat Sink, For Ball Grid Array, BGA, 20 C/W, 6 mm, 27 mm, 27 mm
FISCHER ELEKTRONIK ICK SMD E 22 SA Heat Sink, 21 C/W, 8 mm, 22.3 mm, 22.3 mm
FISCHER ELEKTRONIK - ICK S 25 X 25 X 6,5 - Heat Sink, Pin, 5.4 °C/W, Universal Processor, 25 mm, 6.5 mm, 25 mm
FISCHER ELEKTRONIK ICK PGA 21 X21 Heat Sink, PGA, PGA, 7.1 C/W, 16.51 mm, 53.34 mm, 53.34 mm
Heatsink, BGA, 24.3 8K/W, 21 x 21 x 6mm, Conductive Adhesive, Conductive Foil Mount
FISCHER ELEKTRONIK ICK SMD E 29 SA Heat Sink, For SMD, 18 C/W, 8 mm, 29 mm, 29 mm
FISCHER ELEKTRONIK ICK SMD C 10 SA Heat Sink, For SMD, 26 C/W, 7.5 mm, 30 mm, 10 mm
Width mm = 31 / Thermal Resistance K/W = 18.6 / Heat Sink Material = Aluminium / Length mm = 31 / Perforation = Without / Housing Type = BGA / Type of Surface = Black Anodised / Height mm = 6
FISCHER ELEKTRONIK - ICK SMD A 17 SA - Kylfläns, För SMD, 51 °C/W, SOIC-28, SOIC-32, 6.3 mm, 4.8 mm, 17 mm
FISCHER ELEKTRONIK ICK SMD F 19 SA Heat Sink, 37 C/W, 6 mm, 8 mm, 19 mm
