Monolithic Power Systems
the SLN-VIZNLC-IOT uses two MP2410AGJ Monolithic Power Systems (MPS) Light-Emitting Diode (LED) lighting drivers Integrated circuits (ICs)
Hardware design guide for the SLN-VIZNLC-IOT kit, featuring i.MX RT106F and LPC845 for face recognition, liveness detection, and low-power smart lock applications.
This hardware design guide provides technical details for the SLN-VIZNLC-IOT development kit, an NXP EdgeReady turnkey solution for face recognition-based access control. The architecture employs a dual-MCU strategy: the i.MX RT106F crossover processor handles machine learning, image processing, and liveness detection, while the LPC845 MCU manages low-power system control and PIR-based wake-up functionality. The design incorporates an RGB+IR dual camera module using GalaxyCore GC0308 sensors and a Rocktech RK024HH298 LCD. Connectivity is provided via an integrated K32W061 BLE MCU and an optional Murata 1XK Wi-Fi module. The document covers power management, including DCDC converters and LDOs for battery-optimized operation, and specifies memory configurations including 16 MB QSPI flash and 16 MB SDRAM.
Monolithic Power Systems
the SLN-VIZNLC-IOT uses two MP2410AGJ Monolithic Power Systems (MPS) Light-Emitting Diode (LED) lighting drivers Integrated circuits (ICs)
Winbond
The 16 MB flash uses Winbond W25Q128JVSIM, Small Outline Integrated Circuits (SOIC) 8-pin.
Winbond
The 16 MB SDRAM uses Winbond W9812G6KH-6, Thin Small Outline Package (TSOP) II 54-pin.
Murata
The PIR sensor, which uses the Murata IRA-S210ST01 sensor, is used to wake up the low-power LPC845.
Monolithic Power Systems
Additionally, the SLN-VIZNLC-IOT uses two MP2410AGJ Monolithic Power Systems (MPS) Light-Emitting
Monolithic Power Systems
SYS_5V0 is down-converted to 3.3 V using a DC-to-DC buck converter (MP2181)
NXP
For more details, refer to Murata NXP IW416 Shielded Ultra Small Dual band Wi-Fi® 11a/b/g/n + Bluetooth® 5.2
NXP
The SLN-VIZNLC-IOT uses NXP K32W061 to enable its BLE functionality. The K32W061 communicates using
NXP
NXP LPC845 is based on the Arm Cortex-M0+ core, and it is a low-cost, low-power, 32-bit MCU family which
PAM8013
Diodes Incorporated
uses the Medium Quality Sound (MQS) audio output of the RT106F and an audio amplifier PAM8013
GC03-0CCM-D1
Ningbo JinshengXin Vision Technology
Ningbo JinshengXin Vision Technology GC03-0CCM-D1
RK024HH298
Rocktech
Liquid Crystal Display (LCD) with Rocktech RK024HH298 Enhanced LCD Interface (LCDIF)
YT-MT0308-2-V1-850
Shenzhen Yuantu Photoelectric Technology Co., Ltd
Shenzhen Yuantu Photoelectric Technology Co., Ltd YT-MT0308-2-V1-850
UM1663S
Union Semiconductor
uses LED driver IC UM1663S to drive the backlight.
UM1750S-00
Union Semiconductor
supplied by a Low Drop Out (LDO) (UM1750S-00) which converters USB_5V0 to 3.3 V.
W25Q128JVSQ
Winbond
QSPI FLASH W25Q128JVSQ
| MP2410AGJ | Monolithic Power Systems | the SLN-VIZNLC-IOT uses two MP2410AGJ Monolithic Power Systems (MPS) Light-Emitting Diode (LED) lighting drivers Integrated circuits (ICs) |
| IRA-S210ST01 | Murata | Passive Infrared (PIR) sensor (IRA-S210ST01) |
| LPC845M301JBD48E | NXP | MCU • LPC845M301JBD48E (System Low-Power control) |
| W25Q128JVSIM | Winbond | The 16 MB flash uses Winbond W25Q128JVSIM, Small Outline Integrated Circuits (SOIC) 8-pin. |
| W9812G6KH-6 | Winbond | The 16 MB SDRAM uses Winbond W9812G6KH-6, Thin Small Outline Package (TSOP) II 54-pin. |
| SQ2303ES-T1_GE3 | Vishay | Q1 SQ2303ES-T1_GE3 |
| IRA-S210ST01 | Murata | The PIR sensor, which uses the Murata IRA-S210ST01 sensor, is used to wake up the low-power LPC845. |
| MP2410AGJ | Monolithic Power Systems | Additionally, the SLN-VIZNLC-IOT uses two MP2410AGJ Monolithic Power Systems (MPS) Light-Emitting |
| GC0308 | GalaxyCore | Camera module with GalaxyCore GC0308 image sensors |
| IW416 | NXP | connect to an IW416 Wi-Fi module (1XK M.2 Module). |
| K32W061 | NXP | NXP K32W061 BLE MCU and integrated antenna on PCB |
| MIMXRT106FDVL6A/B | NXP | MCU • MIMXRT106FDVL6A/B Crossover MCU |
| MP2181 | Monolithic Power Systems | SYS_5V0 is down-converted to 3.3 V using a DC-to-DC buck converter (MP2181) |
| MP2182GTL | Monolithic Power Systems | 5 V to 3.3 V DCDC MP2182GTL |
| MMUN2233LT1G | Onsemi | Q2 MMUN2233LT1G |
| 1XK | Murata | • Optional Murata 1XK M.2 Wi-Fi module |
| IW416 | NXP | For more details, refer to Murata NXP IW416 Shielded Ultra Small Dual band Wi-Fi® 11a/b/g/n + Bluetooth® 5.2 |
| K32W061 | NXP | Connectivity • NXP K32W061 BLE MCU and integrated antenna on PCB |
| K32W061 | NXP | The SLN-VIZNLC-IOT uses NXP K32W061 to enable its BLE functionality. The K32W061 communicates using |
| LPC845 | NXP | NXP LPC845 is based on the Arm Cortex-M0+ core, and it is a low-cost, low-power, 32-bit MCU family which |
| PAM8013 | Diodes Incorporated | uses the Medium Quality Sound (MQS) audio output of the RT106F and an audio amplifier PAM8013 |
| GC03-0CCM-D1 | Ningbo JinshengXin Vision Technology | Ningbo JinshengXin Vision Technology GC03-0CCM-D1 |
| RK024HH298 | Rocktech | Liquid Crystal Display (LCD) with Rocktech RK024HH298 Enhanced LCD Interface (LCDIF) |
| YT-MT0308-2-V1-850 | Shenzhen Yuantu Photoelectric Technology Co., Ltd | Shenzhen Yuantu Photoelectric Technology Co., Ltd YT-MT0308-2-V1-850 |
| UM1663S | Union Semiconductor | uses LED driver IC UM1663S to drive the backlight. |
| UM1750S-00 | Union Semiconductor | supplied by a Low Drop Out (LDO) (UM1750S-00) which converters USB_5V0 to 3.3 V. |
| W25Q128JVSQ | Winbond | QSPI FLASH W25Q128JVSQ |