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Design DocumentNxp

NXP SLN-VIZNLC-IOT EdgeReady Smart Lock Hardware Design Guide

Hardware design guide for the SLN-VIZNLC-IOT kit, featuring i.MX RT106F and LPC845 for face recognition, liveness detection, and low-power smart lock applications.

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Overview

This hardware design guide provides technical details for the SLN-VIZNLC-IOT development kit, an NXP EdgeReady turnkey solution for face recognition-based access control. The architecture employs a dual-MCU strategy: the i.MX RT106F crossover processor handles machine learning, image processing, and liveness detection, while the LPC845 MCU manages low-power system control and PIR-based wake-up functionality. The design incorporates an RGB+IR dual camera module using GalaxyCore GC0308 sensors and a Rocktech RK024HH298 LCD. Connectivity is provided via an integrated K32W061 BLE MCU and an optional Murata 1XK Wi-Fi module. The document covers power management, including DCDC converters and LDOs for battery-optimized operation, and specifies memory configurations including 16 MB QSPI flash and 16 MB SDRAM.

Use Cases

  • Consumer and hospitality smart door locks
  • Office and industrial smart-building access control
  • Battery-powered facial recognition systems
  • Secure entry systems with liveness detection
  • Smart home appliance user authentication

Topics

SLN-VIZNLC-IOT
i.MX RT106F
LPC845
Face Recognition
Smart Lock
Liveness Detection
EdgeReady
MIMXRT106FDVL6A
K32W061
Access Control
PIR Sensor

Referenced Parts

MP2410AGJ

Monolithic Power Systems

the SLN-VIZNLC-IOT uses two MP2410AGJ Monolithic Power Systems (MPS) Light-Emitting Diode (LED) lighting drivers Integrated circuits (ICs)

IRA-S210ST01

Murata

Passive Infrared (PIR) sensor (IRA-S210ST01)

W25Q128JVSIM

Winbond

The 16 MB flash uses Winbond W25Q128JVSIM, Small Outline Integrated Circuits (SOIC) 8-pin.

W9812G6KH-6

Winbond

The 16 MB SDRAM uses Winbond W9812G6KH-6, Thin Small Outline Package (TSOP) II 54-pin.

IRA-S210ST01

Murata

The PIR sensor, which uses the Murata IRA-S210ST01 sensor, is used to wake up the low-power LPC845.

MP2410AGJ

Monolithic Power Systems

Additionally, the SLN-VIZNLC-IOT uses two MP2410AGJ Monolithic Power Systems (MPS) Light-Emitting

GC0308

GalaxyCore

Camera module with GalaxyCore GC0308 image sensors

IW416

NXP

connect to an IW416 Wi-Fi module (1XK M.2 Module).

K32W061

NXP

NXP K32W061 BLE MCU and integrated antenna on PCB

MP2181

Monolithic Power Systems

SYS_5V0 is down-converted to 3.3 V using a DC-to-DC buck converter (MP2181)

MP2182GTL

Monolithic Power Systems

5 V to 3.3 V DCDC MP2182GTL

1XK

Murata

• Optional Murata 1XK M.2 Wi-Fi module

IW416

NXP

For more details, refer to Murata NXP IW416 Shielded Ultra Small Dual band Wi-Fi® 11a/b/g/n + Bluetooth® 5.2

K32W061

NXP

Connectivity • NXP K32W061 BLE MCU and integrated antenna on PCB

K32W061

NXP

The SLN-VIZNLC-IOT uses NXP K32W061 to enable its BLE functionality. The K32W061 communicates using

LPC845

NXP

NXP LPC845 is based on the Arm Cortex-M0+ core, and it is a low-cost, low-power, 32-bit MCU family which

PAM8013

Diodes Incorporated

uses the Medium Quality Sound (MQS) audio output of the RT106F and an audio amplifier PAM8013

GC03-0CCM-D1

Ningbo JinshengXin Vision Technology

Ningbo JinshengXin Vision Technology GC03-0CCM-D1

RK024HH298

Rocktech

Liquid Crystal Display (LCD) with Rocktech RK024HH298 Enhanced LCD Interface (LCDIF)

YT-MT0308-2-V1-850

Shenzhen Yuantu Photoelectric Technology Co., Ltd

Shenzhen Yuantu Photoelectric Technology Co., Ltd YT-MT0308-2-V1-850

UM1663S

Union Semiconductor

uses LED driver IC UM1663S to drive the backlight.

UM1750S-00

Union Semiconductor

supplied by a Low Drop Out (LDO) (UM1750S-00) which converters USB_5V0 to 3.3 V.

W25Q128JVSQ

Winbond

QSPI FLASH W25Q128JVSQ