Search Results for &quot; MD82C89B &quot;

Flash Memory, Disk On Chip

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

LM138KG-MD8

Texas Instruments

LM138QML 0-DIESALE -55 to 125

DIE,

Active

Max Operating Temperature: 125

Min Operating Temperature: -55

Terminal Position: UPPER

JEDEC Package Code: X-XUUC-N

MD8331-d2G-V3-X-P

2Gb MLC NAND Flash, 3.3V, 33ns, 69-Pin FBGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

+21

MD8832-D1G-V18-X-P

IC FLASH 1G PARALLEL 69FBGA

Obsolete

Package/Case: FBGA

Interface: Parallel

Max Operating Temperature: 85°C

Memory Type: FLASH, , NAND

MD87C51FB

Intel

8-Bit Microcontroller, 12MHz, UVPROM, 8051 CPU, 40-Pin CERDIP

WDIP, DIP40,.6

Obsolete

Max Operating Temperature: 125

Number of Terminals: 40

Min Operating Temperature: -55

Terminal Position: DUAL

+24

MD8331-D2G-V3-X-P

IC FLASH 2GBIT 33NS 69FBGA

Obsolete

Package/Case: FBGA

Interface: Parallel

Max Operating Temperature: 85°C

Memory Type: FLASH, , NAND

MD8832-D1G-V3-X-P/Y

IC MDOC G4 1GB 69-FBGA

Obsolete

Package/Case: FBGA

Memory Type: FLASH, , NAND

MD8331-D2G-V3-X-P/Y

IC MDOC G4 2GB 69-FBGA

Unknown

Package/Case: FBGA

Memory Type: FLASH, , NAND

MD8832-D1G-V18-X-P/Y

IC MDOC G4 1GB 69-FBGA

Obsolete

Package/Case: FBGA

Memory Type: FLASH, , NAND

MD8331-D2G-V18-X-P/Y

IC MDOC G4 2GB 69-FBGA

Unknown

Package/Case: FBGA

Memory Type: FLASH, , NAND

MD8331-D2G-V18-X-P

IC FLASH 2GBIT 33NS 69FBGA

Obsolete

Package/Case: FBGA

Interface: Parallel

Max Operating Temperature: 85°C

Memory Type: FLASH, , NAND

MD8IC970NR1

850MHz - 940MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER

ROHS COMPLIANT, PLASTIC, CASE 1866-02, TO-270 WBL-16, 16 PIN

Active

Bandwidth: 940MHz

Package/Case: TO-270-16

Frequency: 940MHz

Halogen Free: Halogen Free

MD8IC925NR1

RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER

FLNG,.67"H.SPACE

Active

Number of Functions: 2

MD8331-D2G-V18-X

IC FLASH 2GBIT 33NS 69FBGA

Obsolete

Package/Case: FBGA

Interface: Parallel

Max Operating Temperature: 85°C

Memory Type: FLASH, , NAND

MD8IC925GNR1

RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER

FLNG,.67"H.SPACE

Active

Number of Functions: 2

MD8IC970GNR1

850MHz - 940MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER

ROHS COMPLIANT, PLASTIC, CASE 1866-02, TO-270 WBL-16, 16 PIN

Active

Package/Case: TO-270-16

Frequency: 940MHz

Halogen Free: Halogen Free

Lead Free: Lead Free

MD8832-d00-DAISY-P

Flash Memory, Disk On Chip

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

MD8832-d1Gb-MECH

Flash Memory, Disk On Chip

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

MDA-1-1/2-R

1.5A 250V Time Delay Ceramic Fuse 6.35x31.75mm Holder

Active

Approvals: UL, CSA, CE

Blow Characteristic: TIME DELAY

Body Diameter: 6.35mm

Body Material: Ceramic

+20

MDL-1/4-R

Electric Fuse, Time Lag Blow, 0.25A, 35A (IR),

Active

Approvals: UL, CSA, CE

Blow Characteristic: TIME DELAY

Body Material: Glass

Current Rating: 250mA

+18

Search Results for "MD82C89B"

Filters

MD8832-d1G-V3-X-P

Flash Memory, Disk On Chip

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

LM138KG-MD8

Texas Instruments

LM138QML 0-DIESALE -55 to 125

DIE,

Active

Max Operating Temperature: 125

Min Operating Temperature: -55

Terminal Position: UPPER

JEDEC Package Code: X-XUUC-N

MD8331-d2G-V3-X-P

2Gb MLC NAND Flash, 3.3V, 33ns, 69-Pin FBGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

+21

MD8832-D1G-V18-X-P

IC FLASH 1G PARALLEL 69FBGA

Obsolete

Package/Case: FBGA

Interface: Parallel

Max Operating Temperature: 85°C

Memory Type: FLASH, , NAND

MD87C51FB

Intel

8-Bit Microcontroller, 12MHz, UVPROM, 8051 CPU, 40-Pin CERDIP

WDIP, DIP40,.6

Obsolete

Max Operating Temperature: 125

Number of Terminals: 40

Min Operating Temperature: -55

Terminal Position: DUAL

+24

MD8331-D2G-V3-X-P

IC FLASH 2GBIT 33NS 69FBGA

Obsolete

Package/Case: FBGA

Interface: Parallel

Max Operating Temperature: 85°C

Memory Type: FLASH, , NAND

MD8832-D1G-V3-X-P/Y

IC MDOC G4 1GB 69-FBGA

Obsolete

Package/Case: FBGA

Memory Type: FLASH, , NAND

MD8331-D2G-V3-X-P/Y

IC MDOC G4 2GB 69-FBGA

Unknown

Package/Case: FBGA

Memory Type: FLASH, , NAND

MD8832-D1G-V18-X-P/Y

IC MDOC G4 1GB 69-FBGA

Obsolete

Package/Case: FBGA

Memory Type: FLASH, , NAND

MD8331-D2G-V18-X-P/Y

IC MDOC G4 2GB 69-FBGA

Unknown

Package/Case: FBGA

Memory Type: FLASH, , NAND

MD8331-D2G-V18-X-P

IC FLASH 2GBIT 33NS 69FBGA

Obsolete

Package/Case: FBGA

Interface: Parallel

Max Operating Temperature: 85°C

Memory Type: FLASH, , NAND

MD8IC970NR1

850MHz - 940MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER

ROHS COMPLIANT, PLASTIC, CASE 1866-02, TO-270 WBL-16, 16 PIN

Active

Bandwidth: 940MHz

Package/Case: TO-270-16

Frequency: 940MHz

Halogen Free: Halogen Free

MD8IC925NR1

RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER

FLNG,.67"H.SPACE

Active

Number of Functions: 2

MD8331-D2G-V18-X

IC FLASH 2GBIT 33NS 69FBGA

Obsolete

Package/Case: FBGA

Interface: Parallel

Max Operating Temperature: 85°C

Memory Type: FLASH, , NAND

MD8IC925GNR1

RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER

FLNG,.67"H.SPACE

Active

Number of Functions: 2

MD8IC970GNR1

850MHz - 940MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER

ROHS COMPLIANT, PLASTIC, CASE 1866-02, TO-270 WBL-16, 16 PIN

Active

Package/Case: TO-270-16

Frequency: 940MHz

Halogen Free: Halogen Free

Lead Free: Lead Free

MD8832-d00-DAISY-P

Flash Memory, Disk On Chip

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

MD8832-d1Gb-MECH

Flash Memory, Disk On Chip

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

MDA-1-1/2-R

1.5A 250V Time Delay Ceramic Fuse 6.35x31.75mm Holder

Active

Approvals: UL, CSA, CE

Blow Characteristic: TIME DELAY

Body Diameter: 6.35mm

Body Material: Ceramic

+20

MDL-1/4-R

Electric Fuse, Time Lag Blow, 0.25A, 35A (IR),