Search Results for &quot; XMSSJJ3G0PA-054 &quot;

2-CH DC-IN Transistor Optocoupler, 8-Pin PDIP, 5kV

Through Hole

Obsolete

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: PDIP

Package Description: Plastic Dual In Line Package

LQW15AN9N5J00B

General Purpose Inductor 0402 0.0095uH 25Q 0.14Ohm 0.54A

0402

Active

Max Operating Temperature: 125

Number of Terminals: 2

Min Operating Temperature: -55

Number of Functions: 1

2SJ378(TPND)

P-CH MOSFET 60V 5A Si Through Hole 3-Pin

TPS

Obsolete

Package Family Name: TPS

Package/Case: TPS

Pin Count: 3

PCB: 3

M24128-BFCS6P/K

128Kbit I2C EEPROM, 1.8-5V, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

2SJ378(TPTORIKA)

P-CH MOSFET 60V 5A Si Through Hole 3-Pin

TPS

Obsolete

Package Family Name: TPS

Package/Case: TPS

Pin Count: 3

PCB: 3

M95128-DFCS6G/K

128Kbit EEPROM Serial-SPI 1.8-5V WLCSP 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

2SK2229(Q)

N-CH MOSFET 60V 5A Si Through Hole 3-Pin

TPS

Obsolete

Package Family Name: TPS

Package/Case: TPS

Pin Count: 3

PCB: 3

M24256-DFCS6TG/K

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

LQW15AN8N2G0ZD

Surface Mount General Purpose Inductor, 0.0082uH, 0.14Ohm, 0.54A, 100MHz

Active

Max Operating Temperature: 125

Number of Terminals: 2

Min Operating Temperature: -55

Number of Functions: 1

M95256-DFCS6G/K

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M83446/4-12B

Gowanda

Surface Mount Wirewound Ferrite Inductor 1uH 10% 0.425A 145MHz

Surface Mount

Active

Product Length (mm): 2.79

Product Depth (mm): 2.79

Product Height (mm): 2.16

Number of Terminals: 2

M24128-BWCS6TP/K

128Kb Serial-I2C EEPROM, 8-Pin WLCSP, 3.3V/5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

1250-054

Spectrum

Data Line Filter, 1 Function(s), 70V, 10A,

Active

Capacitance: 5nF

Package/Case: Axial

Current: 10A

Current Rating: 10A

V110B24E200BF3

MINI DC/DC Converter, 24V Output, 200W, Through Hole Mount

Volume Production

Efficiency: 87.3%

Features: UVLO, OVP

Height: 0.54inch

Isolation Voltage: 3kV

V300B5T150B3

MINI DC/DC Converter, 5V Output, 150W, Through Hole Mount

Volume Production

Efficiency: 83%

Features: UVLO, OVP

Height: 0.54inch

Isolation Voltage: 3kV

V24B12C200BF

MINI Series DC/DC Converter, 12V Output, 200W, Through Hole Mount

Volume Production

Efficiency: 86%

Features: UVLO, OVP

Height: 0.54inch

Isolation Voltage: 3kV

2-6754412-7

TE Connectivity

Multimode Fiber Optic Cable, 27m, Twin Zip, Orange, OFNR Jacket, Duplex

Volume Production

Color: Orange

Connector Type A: SC Duplex, MT-RJ

Connector Type B: MT-RJ, SC

Connectors Color: Green

LQH2HPZ3R3MDRL

General Purpose RF Inductor, 3.3uH, 0.54 Ohm, 0.73A, Shielded, 1008 CHIP

CHIP, 1008

Active

Max Operating Temperature: 125

Number of Terminals: 2

Min Operating Temperature: -40

Number of Functions: 1

LQH32DN6R8M53L

Inductor Power Unshielded Wirewound 6.8uH 20% 1MHz Ferrite 0.54A 0.325Ohm DCR 1210 T/R

CHIP, 1210

Active

Max Operating Temperature: 105

Number of Terminals: 2

Min Operating Temperature: -40

Number of Functions: 1

Distributor	Stock	34+	168+
Quest	448	$0.3	$0.2

Search Results for "XMSSJJ3G0PA-054"

Filters

TLP621-2(D4-GB)

2-CH DC-IN Transistor Optocoupler, 8-Pin PDIP, 5kV

Through Hole

Obsolete

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: PDIP

Package Description: Plastic Dual In Line Package

LQW15AN9N5J00B

General Purpose Inductor 0402 0.0095uH 25Q 0.14Ohm 0.54A

0402

Active

Max Operating Temperature: 125

Number of Terminals: 2

Min Operating Temperature: -55

Number of Functions: 1

2SJ378(TPND)

P-CH MOSFET 60V 5A Si Through Hole 3-Pin

TPS

Obsolete

Package Family Name: TPS

Package/Case: TPS

Pin Count: 3

PCB: 3

M24128-BFCS6P/K

128Kbit I2C EEPROM, 1.8-5V, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

2SJ378(TPTORIKA)

P-CH MOSFET 60V 5A Si Through Hole 3-Pin

TPS

Obsolete

Package Family Name: TPS

Package/Case: TPS

Pin Count: 3

PCB: 3

M95128-DFCS6G/K

128Kbit EEPROM Serial-SPI 1.8-5V WLCSP 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

2SK2229(Q)

N-CH MOSFET 60V 5A Si Through Hole 3-Pin

TPS

Obsolete

Package Family Name: TPS

Package/Case: TPS

Pin Count: 3

PCB: 3

M24256-DFCS6TG/K

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

LQW15AN8N2G0ZD

Surface Mount General Purpose Inductor, 0.0082uH, 0.14Ohm, 0.54A, 100MHz

Active

Max Operating Temperature: 125

Number of Terminals: 2

Min Operating Temperature: -55

Number of Functions: 1

M95256-DFCS6G/K

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M83446/4-12B

Gowanda

Surface Mount Wirewound Ferrite Inductor 1uH 10% 0.425A 145MHz

Surface Mount

Active

Product Length (mm): 2.79

Product Depth (mm): 2.79

Product Height (mm): 2.16

Number of Terminals: 2

M24128-BWCS6TP/K

128Kb Serial-I2C EEPROM, 8-Pin WLCSP, 3.3V/5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

1250-054

Spectrum

Data Line Filter, 1 Function(s), 70V, 10A,

Active

Capacitance: 5nF

Package/Case: Axial

Current: 10A

Current Rating: 10A

V110B24E200BF3

MINI DC/DC Converter, 24V Output, 200W, Through Hole Mount

Volume Production

Efficiency: 87.3%

Features: UVLO, OVP

Height: 0.54inch

Isolation Voltage: 3kV

V300B5T150B3

MINI DC/DC Converter, 5V Output, 150W, Through Hole Mount

Volume Production

Efficiency: 83%

Features: UVLO, OVP

Height: 0.54inch

Isolation Voltage: 3kV

V24B12C200BF

MINI Series DC/DC Converter, 12V Output, 200W, Through Hole Mount

Volume Production

Efficiency: 86%

Features: UVLO, OVP

Height: 0.54inch

Isolation Voltage: 3kV

2-6754412-7

TE Connectivity

Multimode Fiber Optic Cable, 27m, Twin Zip, Orange, OFNR Jacket, Duplex

Volume Production

Color: Orange

Connector Type A: SC Duplex, MT-RJ

Connector Type B: MT-RJ, SC

Connectors Color: Green

LQH2HPZ3R3MDRL

General Purpose RF Inductor, 3.3uH, 0.54 Ohm, 0.73A, Shielded, 1008 CHIP

CHIP, 1008

Active

Max Operating Temperature: 125

Number of Terminals: 2

Min Operating Temperature: -40

Number of Functions: 1

LQH32DN6R8M53L

Inductor Power Unshielded Wirewound 6.8uH 20% 1MHz Ferrite 0.54A 0.325Ohm DCR 1210 T/R