Search Results for &quot; ADC-6-13 &quot;

32-bit ARM Cortex-M0 MCU, 16KB Flash, 48MHz, LQFP

LFQFP,

Active

Package/Case: LQFP

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, IrDA, UART, USART, LIN, I2S

Distributor	Stock	1+	5+
TME	243	$2.41	$2.09

MK61FX512VMD12

32-bit ARM Cortex M4 MCU, 120MHz, 512KB Flash, 144-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

Distributor	Stock	6+	19+	81+	170+
Quest	640	$13.5502	$12.5339	$11.8564	$10.8402

MK40DX128VMD10

32-bit ARM Cortex M4 MCU, 100MHz, 128KB Flash, 144-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

STM32F031G4U6

32b ARM MCU, 48MHz, 16KB FLASH, UFQFPN, 23 I/O

VQCCN,

Active

Package/Case: UFQFPN

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, IrDA, UART, USART, I2S

Distributor	Stock	1+	5+	10+	25+
TME	0	$1.9	$1.7	$1.55	$1.4

STM32U585STM32U5

160MHz Cortex-M33 MCU, 2MB Flash, 786KB SRAM, ULP, TrustZone, Crypto, rich I/O

Multiple: LQFP (48/64/100/144), UFBGA (132/169), WLCSP90, UFQFPN48

Active

CPU core: Arm Cortex‑M33 with TrustZone, FPU, DSP, MPU

Max clock frequency: 160MHz

Performance: 240 DMIPS; 4.07 CoreMark/MHz (651 total)DMIPS; CoreMark/MHz

Flash memory: 2 (dual‑bank, ECC, RWW; 512KB @100k cycles)MB

DSPIC33FJ06GS101A-I/SS

16-bit dsPIC MCU, 6KB FLASH, 40MHz, 13 I/O, SSOP

Volume Production

Address Bus Width: 16b

Package/Case: SSOP

Core Architecture: dsPIC

Data Bus Width: 16b

DSPIC33FJ06GS101A-I/SO

16-bit dsPIC MCU, 40MHz, 6KB Flash, SOIC, 13 I/O

SOIC-18

Active

Address Bus Width: 16b

Package/Case: SOIC

Core Architecture: dsPIC

Data Bus Width: 16b

HD6417727BP100CV

Renesas

32-bit SH3-DSP RISC MCU, 100MHz, 240-Pin LFBGA, ROMLess

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

ST62T60BM3

8-Bit 8MHz OTPROM MCU, 20-Pin SOIC, Automotive, 3-6V

0.300 INCH, PLASTIC, SO-20

Active

Max Operating Temperature: 125

Number of Terminals: 20

Min Operating Temperature: -40

Terminal Position: DUAL

PIC16C71-04E/P

8-Bit RISC MCU, 4MHz, OTPROM, 18-Pin PDIP, Automotive

0.300 INCH, PLASTIC, DIP-18

Active

Max Operating Temperature: 125

Number of Terminals: 18

Min Operating Temperature: -40

Terminal Position: DUAL

PIC16LC71-04E/SO

8-Bit RISC MCU, 4MHz, OTPROM, 18-Pin SOIC, Automotive

0.300 INCH, PLASTIC, SOIC-18

Active

Max Operating Temperature: 125

Number of Terminals: 18

Min Operating Temperature: -40

Terminal Position: DUAL

PIC16C71-20E/P

8-Bit RISC MCU, 20MHz, OTPROM, 18-Pin PDIP, Automotive

0.300 INCH, PLASTIC, DIP-18

Active

Max Operating Temperature: 125

Number of Terminals: 18

Min Operating Temperature: -40

Terminal Position: DUAL

PIC16C71-04E/SO

8-Bit RISC MCU, 4MHz, OTPROM, 18-Pin SOIC, Automotive

0.300 INCH, PLASTIC, SOIC-18

Active

Max Operating Temperature: 125

Number of Terminals: 18

Min Operating Temperature: -40

Terminal Position: DUAL

STM32F051K6U6TR

32-bit ARM Cortex-M0 MCU, 48MHz, 32KB Flash, 27 I/O, UFQFPN

HVQCCN, LCC32,.2SQ,20

Active

Package/Case: UFQFPN

Core Architecture: ARM

Data Bus Width: 32b

Height: 0.55mm

DSPIC33FJ12GP201-I/P

16-Bit MCU, 40MHz, 12KB Flash, 13 I/O, PDIP

Volume Production

Package/Case: PDIP

Core Architecture: dsPIC

Data Bus Width: 16b

Density: 12KB

ST62P53CB6/XXX

8-Bit MCU, 8MHz, 20-Pin DIP, Industrial Temp

0.300 INCH, PLASTIC, DIP-20

Active

Max Operating Temperature: 85

Number of Terminals: 20

Min Operating Temperature: -40

Terminal Position: DUAL

STM32F051C6U6

32-bit ARM Cortex-M0 MCU, 48MHz, 32KB Flash, UFQFPN, 39 I/O

HVQCCN,

Active

Package/Case: UFQFPN

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 48MHz

C8051F046-GQ

Silicon Labs

8-Bit 8051 MCU, 32KB FLASH, 25MHz, TQFP-100

TFQFP, TQFP100,.63SQ

Not Recommended

Access Time: 25us

Package/Case: TQFP

Contact Plating: Tin

Core Architecture: 8051

ADUC7022BCPZ62

16-Bit 44MHz ARM MCU, 62KB Flash, 10 ADC, 12-Bit, LFCSP

Volume Production

Access Time: 44us

Package/Case: LFCSP EP

Contact Plating: Tin, Matte

Core Architecture: ARM

ADUC7022BCPZ32

ARM MCU, 12-Bit ADC, 1MS/s, 32KB Flash, 44MHz, LFCSP

Volume Production

Access Time: 44us

Package/Case: LFCSP EP

Contact Plating: Tin, Matte

Core Architecture: ARM

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Search Results for "ADC-6-13"

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STM32F031C4T6

32-bit ARM Cortex-M0 MCU, 16KB Flash, 48MHz, LQFP

LFQFP,

Active

Package/Case: LQFP

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, IrDA, UART, USART, LIN, I2S

Distributor	Stock	1+	5+
TME	243	$2.41	$2.09

MK61FX512VMD12

32-bit ARM Cortex M4 MCU, 120MHz, 512KB Flash, 144-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

Distributor	Stock	6+	19+	81+	170+
Quest	640	$13.5502	$12.5339	$11.8564	$10.8402

MK40DX128VMD10

32-bit ARM Cortex M4 MCU, 100MHz, 128KB Flash, 144-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

STM32F031G4U6

32b ARM MCU, 48MHz, 16KB FLASH, UFQFPN, 23 I/O

VQCCN,

Active

Package/Case: UFQFPN

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, IrDA, UART, USART, I2S

Distributor	Stock	1+	5+	10+	25+
TME	0	$1.9	$1.7	$1.55	$1.4

STM32U585STM32U5

160MHz Cortex-M33 MCU, 2MB Flash, 786KB SRAM, ULP, TrustZone, Crypto, rich I/O

Multiple: LQFP (48/64/100/144), UFBGA (132/169), WLCSP90, UFQFPN48

Active

CPU core: Arm Cortex‑M33 with TrustZone, FPU, DSP, MPU

Max clock frequency: 160MHz

Performance: 240 DMIPS; 4.07 CoreMark/MHz (651 total)DMIPS; CoreMark/MHz

Flash memory: 2 (dual‑bank, ECC, RWW; 512KB @100k cycles)MB

DSPIC33FJ06GS101A-I/SS

16-bit dsPIC MCU, 6KB FLASH, 40MHz, 13 I/O, SSOP

Volume Production

Address Bus Width: 16b

Package/Case: SSOP

Core Architecture: dsPIC

Data Bus Width: 16b

DSPIC33FJ06GS101A-I/SO

16-bit dsPIC MCU, 40MHz, 6KB Flash, SOIC, 13 I/O

SOIC-18

Active

Address Bus Width: 16b

Package/Case: SOIC

Core Architecture: dsPIC

Data Bus Width: 16b

HD6417727BP100CV

Renesas

32-bit SH3-DSP RISC MCU, 100MHz, 240-Pin LFBGA, ROMLess

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

ST62T60BM3

8-Bit 8MHz OTPROM MCU, 20-Pin SOIC, Automotive, 3-6V

0.300 INCH, PLASTIC, SO-20

Active

Max Operating Temperature: 125

Number of Terminals: 20

Min Operating Temperature: -40

Terminal Position: DUAL

PIC16C71-04E/P

8-Bit RISC MCU, 4MHz, OTPROM, 18-Pin PDIP, Automotive

0.300 INCH, PLASTIC, DIP-18

Active

Max Operating Temperature: 125

Number of Terminals: 18

Min Operating Temperature: -40

Terminal Position: DUAL

PIC16LC71-04E/SO

8-Bit RISC MCU, 4MHz, OTPROM, 18-Pin SOIC, Automotive

0.300 INCH, PLASTIC, SOIC-18

Active

Max Operating Temperature: 125

Number of Terminals: 18

Min Operating Temperature: -40

Terminal Position: DUAL

PIC16C71-20E/P

8-Bit RISC MCU, 20MHz, OTPROM, 18-Pin PDIP, Automotive

0.300 INCH, PLASTIC, DIP-18

Active

Max Operating Temperature: 125

Number of Terminals: 18

Min Operating Temperature: -40

Terminal Position: DUAL

PIC16C71-04E/SO

8-Bit RISC MCU, 4MHz, OTPROM, 18-Pin SOIC, Automotive

0.300 INCH, PLASTIC, SOIC-18

Active

Max Operating Temperature: 125

Number of Terminals: 18

Min Operating Temperature: -40

Terminal Position: DUAL

STM32F051K6U6TR

32-bit ARM Cortex-M0 MCU, 48MHz, 32KB Flash, 27 I/O, UFQFPN

HVQCCN, LCC32,.2SQ,20

Active

Package/Case: UFQFPN

Core Architecture: ARM

Data Bus Width: 32b

Height: 0.55mm

DSPIC33FJ12GP201-I/P

16-Bit MCU, 40MHz, 12KB Flash, 13 I/O, PDIP

Volume Production

Package/Case: PDIP

Core Architecture: dsPIC

Data Bus Width: 16b

Density: 12KB

ST62P53CB6/XXX

8-Bit MCU, 8MHz, 20-Pin DIP, Industrial Temp

0.300 INCH, PLASTIC, DIP-20

Active

Max Operating Temperature: 85

Number of Terminals: 20

Min Operating Temperature: -40

Terminal Position: DUAL

STM32F051C6U6

32-bit ARM Cortex-M0 MCU, 48MHz, 32KB Flash, UFQFPN, 39 I/O

HVQCCN,

Active

Package/Case: UFQFPN

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 48MHz

C8051F046-GQ

Silicon Labs

8-Bit 8051 MCU, 32KB FLASH, 25MHz, TQFP-100

TFQFP, TQFP100,.63SQ

Not Recommended

Access Time: 25us

Package/Case: TQFP

Contact Plating: Tin

Core Architecture: 8051

ADUC7022BCPZ62

16-Bit 44MHz ARM MCU, 62KB Flash, 10 ADC, 12-Bit, LFCSP

Volume Production

Access Time: 44us

Package/Case: LFCSP EP

Contact Plating: Tin, Matte

Core Architecture: ARM

ADUC7022BCPZ32

ARM MCU, 12-Bit ADC, 1MS/s, 32KB Flash, 44MHz, LFCSP