| Image | Part Number | Manufacturer | Description |
|---|---|---|---|
 | A16104-10 | Laird | Silicone Thermal Pad 229x229mm, 2.54mm Thick, 200°C Max |
| AP4512HX-J90-4P-TA-LF | Adda | CPU & Chip Coolers 45mm 12VDC 6CFM | |
 | GPVOUS-0.125-00-4/4 | Bergquist | GAP PAD VO-U/S, .125", 4"X4" SHEET |
 | A15796-27 | Laird | Silicone Thermal Pad 9"x9" 5mm Grey UL94 V-0 |
| A10092-02 | Laird | Thermal Interface Products Tpli 210 FG A1 8x8" 6 W/mK gap filler | |
| A12446-01 | Laird | Thermal Interface Products Tmate 2920 9x9" 2.2 W/mK TIM | |
 | A12618-01 | Laird | Thermal Interface Products Tflex 640 9x9 3.0W/mK gap filler |
| A10093-37 | Laird | Thermal Interface Products Tpli220 FG A0 16x16" 6 W/mK gap filler | |
 | GP2000S40-0.040-02-4/4 | Bergquist | THERMALLY CONDUCTIVE GAP FILING MATERIAL; Insulator Body Material:Fibreglass; Thermal Conductivity:2W/m.K; Breakdown Voltage Vbr:5kV; Thickness:1.016mm; Volume Resistivity:10ohm-m; Thermal Impedance:0.97 C/W; Dielectric Strength:- ;RoHS Compliant: Yes |
| GPVOUS-0.200-00-4/4 | Bergquist | BERGQUIST GPVOUS-0.200-00-4/4 Thermal Insulator, Gap Pad VO Ulta Soft, .200", 4" x 4" Sheet, 1 W/m.K, 6 kV, 5.08 mm, 10 ohm-m | |
 | A15750-00 | Laird | Thermal Interface Material, 150°C, UL94 V-0, Kapton/Ceramic/Polyimide |
| SP900S-0.009-00-43 | Bergquist | THERM PAD 19.05MMX12.7MM PINK | |
| A10462-20 | Laird | Thermal Interface Products Tgon 805,A1 18" x 24" | |
| A10092-63 | Laird | Thermal Interface Products Tpli210 FG A0 16x16" 6 W/mK gap filler | |
| GP2000S40-0.080-02-4/4 | Bergquist | 8783470 | |
| A16104-20 | Laird | THERM PAD 228.6MMX228.6MM GRAY | |
| 647-20ABPE | Wakefield | WAKEFIELD SOLUTIONS 647-20ABPE HEAT SINK | |
| 175-6-320P | Wakefield | GLOVE, POLYAMIDE, L/FREE, PU, SIZE 6 - More Details | |
| A12620-01 | Laird | Thermal Interface Products Tflex 660 9x9" 3.0W/mK gap filler | |
 | 4662 | Keystone Electronics | INSULATOR 1.594X1.141" TO-3CASE |
