 | 144-2 | Wakefield | WAKEFIELD SOLUTIONS 144-2 SPRING ASSEMBLY |
 | HF115AC-0.0055-AC-90 | Bergquist | Thermal Pad, 0.35°C/W, TO-218, Grey, Rectangular |
 | A10245-06 | Laird | TPutty 502 Thermal Interface Material, 200°C, -45°C, 0.16inch Thick |
 | GPVOUS-0.200-00-4/4 | Bergquist | BERGQUIST GPVOUS-0.200-00-4/4 Thermal Insulator, Gap Pad VO Ulta Soft, .200", 4" x 4" Sheet, 1 W/m.K, 6 kV, 5.08 mm, 10 ohm-m |
 | A10464-07 | Laird | Thermal Interface Products Tgon 820,A0 18" x 24" |
 | 4672 | Keystone Electronics | TO-220 Mica Thermal Insulator, 0.141inch Diameter, Lead Free |
 | SP900S-0.009-00-43 | Bergquist | THERM PAD 19.05MMX12.7MM PINK |
 | 4667 | Keystone Electronics | KEYSTONE 4667 TRANSISTOR INSULATOR |
 | 175-6-250P | Wakefield | GLOVE, POLYAMIDE, L/FREE, PU, SIZE 6 - More Details |
 | FK24408DPAK | Fischer Elektronik | SOT-23 Copper Heat Sink, 10mm x 8mm x 23mm, 31.5°C/W Thermal Resistance |
 | 175-6-320P | Wakefield | Thermal Management TO-3 Heatsink, Grey, Kapton Insulation, Lead Free |
 | 350AB1500B | ABL Heatsinks | ABL HEATSINKS 350AB1500B Heat Sink, 0.74 C/W, 50 mm, 125 mm, 150 mm |
 | 055013 | Nmb-Minebea | Axial Thermal Management Component, Steel, Chrome Finish, 89.4mm Height, 89.4mm Width |
 | A15326-02 | Laird | Tflex 300 Ceramic and Silicone Thermal Management Component |
 | A10538-17 | Laird | Thermal Interface Material 502, 0.02inch Thick, 229mm Square, -45°C to 200°C |
 | 10637-4-1040 | Ebm-Papst | EBM PAPST 10637-4-1040 LEAD, POWER, 450MM FOR W1G200 ESM |
 | A15973-05 | Laird | Tflex 300 Silicone Thermal Management Component |
 | A10464-01 | Laird | Tgon 820 Graphite Rectangular Heatsink, 0.51mm Thick, 457mm Wide, 305mm Long |
 | A15340-01 | Laird | Tflex 300 Ceramic/Silicone Thermal Interface, 9inch Square, 160°C/−40°C |
 | A10093-37 | Laird | Thermal Interface Products Tpli220 FG A0 16x16" 6 W/mK gap filler |
